EM-5026AM main features:
• use of cassettes for wafer loading;
• centering and orientation based on primary flat;
• preliminary fine orientation;
• wafer loading on a chuck;
• wafer wedge and thickness compensation without contact with the photomask;
• operator controlled alignment proximity;
• alignment mark alignment error definition on photomasks and wafers;
• exposure of wafer photoresist layer;
• unloading to another cassette;
• energy saving mode.
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EM-5126
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EM-5106
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EM-5026AM
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Working wavelengths*, nm
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225-260;
280-330;
350-450
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225-260;
280-330;
350-450
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225-260;
280-335;
350-450
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Photolithography resolution, µm
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0.6 ... 0.8
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0.6 ... 0.8
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0.4 ... 0.7
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Workfield illumination uniformity, %
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±2.5
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±2.5
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±2.5
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Alignment accuracy random component, µm
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±0.1
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±0.1
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±0.1
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Wafer diameter, mm
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150
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150
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50; 60; 76; 100; 60x48
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Mask size, mm
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177.8 x 117.8
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177.8 x 117.8
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102 x 102; 127 x 127
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Microscope with two split fields of view and smooth magnification adjustment:
-OM 0.4/8 objectives and 10x eyepieces
-OM 0.2/14 objectives and 10x eyepieces
*Displayed image
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400 … 1000*
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150 … 470
85 … 270
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150x ... 480x
90x ... 250x
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Two-field microscope magnification with split field and smooth magnification adjustment: - 10х eyepieces and ОМ-0.2/14.5 (ОМ1-0.4/8) objective lenses, x
- together with color video camera for 23” display size, x
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—
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85 … 270 (150 … 470)
225 … 560 (400… 1000)
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—
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Power consumption, not more than, W
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855
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800
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800
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