EM-6329R is applied for automatic inspection of reticles and work photomasks with transparent and opaque defects: pindots, pinholes, protrusions, mouse bites, shorts between features, breaks, corner roundings, size shifts, half-tone defects, etc. according to SEMI standars.
The automatic defect inspection is performed through die-to-database inspection to SEMI standards.After completion of inspection cycle, the defect list is formed and the operator observes the defects on the display screen.
Minimum detected defect size - 0.15 µm
Inspection time of 100x100mm area - 25 min
Inspection time of 100x100mm area with doubled pixel(0.5µm) - 7 min
Working field size - 153х153 mm
X-Y stage resolution - 5 nm
Visual channel magnification factor 150, 600, 2000
Reference image feature size correction range- 50 ... 250 nm
Defect programmed filtering range - 0.25 ... 2.5µm
Pellicle frame maximum height (at each side of a mask)- 8 mm
Database formats ZBA,GDS,DXF, proprietory
Power consumption - 1.8 kW