SINGULUS TECHNOLOGIES is a renowned manufacturer of advanced thin-film deposition equipment for MRAM, thin-film head, sensor and other semiconductor applications.
The flexible sputter deposition system ROTARIS is ideal for deposition of multilayers with a very high uniformity and a excellent thickness control. The ROTARIS is a bridge system for 200 mm and 300 mm wafer processing. Its main deposition chamber, the Rotating-Substrate-Module, can be equipped with up to 12 sputtering cathodes with a target diameter of 100 mm.
The ROTARIS design provides in particular a rotating substrate deposition technology with the additional capability to tilt the substrate. Additional features are “Co-sputtering” with up to four cathodes, DC-, pulsed DC-, RF-sputtering, wafer heating, and an in-situ aligning magnetic field. The installation of an ion source as alternative equipment allows for surface treatment and smoothing, ion milling and side wall cleaning.
Advantages
- High flexibility due up to 12 Targets in one deposition chamber
- High throughput for multilayer deposition with short change time between the materials
- Outstanding homogeneity
- Excellent Sub-Å thickness control with high repeatability
- Co-Sputtering opportunity with up to 4 cathodes
- Qualified processes for production
- Cost efficient solution
ROTARIS Basic
ROTARIS Basic sputtering system for processing up to 200 mm wafer.
Example of configuration:
- 1x Rotating-Substrate-Module RSM
- 1x Manual wafer load lock
ROTARIS Advanced
ROTARIS Advanced sputtering system with additional modules for processing up to 200 mm wafer.
Example of configuration:
- 1 x Rotating-Substrate-Module RSM
- 1 x Combi-Process-Module CMP
- 1 x MX400 Central-Transport-Module CTM
ROTARIS Diversity
ROTARIS Diversity sputtering system with six modules for advanced processing up to 200 mm wafer.
Example of configuration:
- 3 x Rotating-Substrate-Module RSM
- 1 x Combi-Process-Module CMP
- 1 x Small-Thermal-Process-Module sTPM
- 1 x MX700 Central-Transport-Module CTM