Santa Clara, CA: PacTech, leading supplier of wafer level bumping and packaging services, is pleased to announce the 15th anniversary of PacTech USA in Santa Clara! Thriving for a decade and a half at a time when Silicon Valley companies come and go in the blink of an eye is a true accomplishment. President & CEO of PacTech Group, Mr. Heinrich Luedeke, “PacTech USA is not only a demonstration center for the advanced packaging equipment manufactured at PacTech Germany in the Berlin region. PacTech USA is also a subcontractor that helps customers with their needs with wafer level chip scale packaging (WLCSP), 2.5D Interposers, and rigid or flex substrates!”
A wide range of wafer bumping subcontracting services is available in Santa Clara, including UBM (under bump metal) and OPM (over pad metal) plating, solder ball attach, wafer repassivation, wafer level RDL and CSP & BGA ball rework/re-balling. Services in the area of backend, inspection & die sorting/packaging include laser marking, wafer sawing, AOI (automated optical inspection), chip level manual microscope inspection and die packaging.
A special highlight of PacTech USA’s extensive range of services is its double-sided interconnection on glass interposer for the prototyping sector. This technology is the fastest means of producing flip-chips – priceless technology when time to demonstration is tight. Moreover, we take a very flexible approach, putting the needs of our customers first.
PacTech USA works closely with its German headquarters, which is going from strength-to-strength – they are currently establishing a three-shift system to keep up with all contract orders and was recently accredited according to the ISO 14001 standard – a feat that only a few German companies in our sector have accomplished to date! Dr. Thorsten Teutsch, President & COO of PacTech USA, added, “We continue making investments in new capabilities and expanded services, such as electroplating of copper, repassivation, and redistribution (RDL), to support our customers in the Americas.”