PacTech-Packaging Technologies GmbH

Am Schlangenhorst 15-17
Nauen,  D-14641

  • Booth: 537

Equipment Manufacturing and Subcontracting Services

With more than 20 years of experience, PacTech is a prime manufacturer of leading-edge technology equipment and processes for the advanced packaging industry. PacTech designs, manufactures and supports solder jetting equipment, wafer-level solder ball transfer systems, wafer-level solder rework equipment, laser assisted flip-chip bonders and automatic plating tools for high volume eless Ni/Au and Ni/Pd/Au UBM and OPM through its global sales network.

In Europe, the U.S. and Malaysia, the full enterprise portfolio of different manufacturing services is available, as well as all of the backend solutions.  

PacTech offers the capability to do demonstration including samples and prototyping under ISO certified production conditions. More over PacTech has an unique dual business model in which it offers its customers especially low volume production customers or new starters in to that industry the option to use in the initial phase PacTech’s demo centers for services. After qualification of the product the customer has the option of further cost reduction by having full turnkey solution with equipment, process and technology.


 Press Releases

  • Santa Clara, CA: PacTech, leading supplier of wafer level bumping and packaging services, is pleased to announce the 15th anniversary of PacTech USA in Santa Clara! Thriving for a decade and a half at a time when Silicon Valley companies come and go in the blink of an eye is a true accomplishment. President & CEO of PacTech Group, Mr. Heinrich Luedeke, “PacTech USA is not only a demonstration center for the advanced packaging equipment manufactured at PacTech Germany in the Berlin region.  PacTech USA is also a subcontractor that helps customers with their needs with wafer level chip scale packaging (WLCSP), 2.5D Interposers, and rigid or flex substrates!”  

    A wide range of wafer bumping subcontracting services is available in Santa Clara, including UBM (under bump metal) and OPM (over pad metal) plating, solder ball attach, wafer repassivation, wafer level RDL and CSP & BGA ball rework/re-balling. Services in the area of backend, inspection & die sorting/packaging include laser marking, wafer sawing, AOI (automated optical inspection), chip level manual microscope inspection and die packaging.


    A special highlight of PacTech USA’s extensive range of services is its double-sided interconnection on glass interposer for the prototyping sector. This technology is the fastest means of producing flip-chips – priceless technology when time to demonstration is tight. Moreover, we take a very flexible approach, putting the needs of our customers first.


    PacTech USA works closely with its German headquarters, which is going from strength-to-strength – they are currently establishing a three-shift system to keep up with all contract orders and was recently accredited according to the ISO 14001 standard – a feat that only a few German companies in our sector have accomplished to date! Dr. Thorsten Teutsch, President & COO of PacTech USA, added, “We continue making investments in new capabilities and expanded services, such as electroplating of copper, repassivation, and redistribution (RDL), to support our customers in the Americas.”


  • PacLine 300 A50
    - Electroless Ni/Au & Ni/Pd/Au UBM/OPM; - No Tooling; - 4-12'' Wafers - Up to 150 Wafers/hour - In-line bathcontrol...

  • The – PacLine 300 A50 – is fully automated equipment for electroless deposition of Ni/Au or Ni/Pd/Au bumps on semiconductor wafers with Al or Cu pad metallization. The system is able to process carriers with 50 wafers up to 8” and 26 wafers 12”.The PacLine contains of a complete software solution for recipe management, process control and data logging. Complex failure and emergency routines are providing a secure system operation for handling of up to 3 process carrier in parallel. The usage of SECS GEM communication protocol enables direct interfacing with the facility host and flexible final adjustment on customer requirements. Pac Tech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping.

  • SB²-Jet
    - Laser Solder Jetting System; - Fluxless Solder Jetting for Camera Modules, Hard Disk Drives (HGA, HSA, Hook-Up) - MEMS - 3D Soldering - Deballing & Rework...

  • The SB²-Jet solder balling system is the ideal solution for flexible solder ball placement and laser reflow.
    At an average speed of 7 balls  per second, it is  one of the fastest machines on the market today. Different machine platforms are available, from small and midsize semiautomatic machines for prototyping and R&D to high volume (24/7) production machines with various possibilities of different handling systems. The machines provide a reproducible and reliable solder bumping technology for:
    Wafers, Optoelectronic Devices, MEMS, Sensors, BGA's, CSP, cLCC's, QFN's, Flip Chips, HDD (HGA, HSA), Camera Modules and many more applications.
  • Ultra-SB²
    Micro Ball Bumping for Flip Chip & Wafer Level CSP...

  • Volume solder ball placement solutions for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip applications and 200µm and higher for Wafer Level CSP.
    Cantilever Bonder and Cutter - High Accuracy Automatic Laser Bonder on Probe Card Level ...

  • • 2D & 3D Laser Bonding on Probe Card
    • Ultra-Fine-Pitch Placement
    • Temperature controlled laser reflow
    • Post bond inspection
    • Single probe pin rework
    • Active inline correction of deformed pins
    • Probe Card assembly up to 21 inch
    • Laser cutting of MEMS structure


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