EV Group

DI Erich Thallner Strasse 1
St. Florian/Inn,  A-4782

  • Booth: 950

Visit EV Group (EVG) at booth #950!

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at  www.EVGroup.com.

 Press Releases

  • EVG leverages more than 15 years of experience in biotech R&D and industry-proven substrate bonding and lithography solutions and expertise to support next-generation biotechnology device manufacturing


    ST. FLORIAN, Austria, September 26, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market. EVG products supporting this market include the company’s substrate bonding, hot-embossing, micro contact printing and UV-based nanoimprint lithography (NIL) systems. In addition, EVG will offer its world-class applications support, rapid prototyping and pilot-line production services. Customers in the biotechnology and medical markets can now leverage these patterning and sealing solutions—which have been production-proven in other industrial markets such as semiconductors, MEMS and photonics—for volume production of next-generation biotechnology devices featuring micrometer or nanometer-scale patterns and structures on larger-format substrates.

    Over the past several decades, miniaturization of biotechnology devices has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices—such as biomedical MEMS (bioMEMS) for diagnostics, cell analysis and drug discovery—are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. According to the market research and strategy consulting firm Yole Développement, an increasing number of healthcare applications are using bioMEMS components, while the bioMEMS market is expected to triple from US$2.7 billion in 2015 to US$7.6 billion in 2021. Microfluidic devices will represent the majority (86 percent) of the total bioMEMS market in 2021, driven by applications such as Point-of-Need testing, clinical and veterinary diagnostics, pharmaceutical and life science research, and drug delivery*.

    Precise and cost-effective micro-structuring technologies are essential to successfully commercialize these products in a rapidly growing market that has stringent requirements and high regulatory hurdles. Traditional process approaches such as injection molding are often unable to produce the extremely small structures and surface patterns with the precision, quality and repeatability increasingly required for these demanding applications, or they require extensive effort in process development. At the same time, solutions are needed to scale up from discrete production of devices to batch processing of multiple devices on a single substrate in order to achieve the economies of scale required to commercialize these products.

    NIL has evolved from a niche technology to a powerful high-volume manufacturing method that is able to produce a multitude of structures of different sizes and shapes on a large scale—such as highly complex microfluidic channels and surface patterns—by imprinting either into a biocompatible resist or directly into the bulk material. In addition to structuring technologies, sealing and encapsulation is a central process for establishing confined microfluidic channels. Thus, bonding of different device layers, capping layers or interconnection layers is a key process that can be implemented together with NIL in a cost-effective large-area batch process. As the pioneer as well as market and technology leader in NIL and wafer bonding, EVG is leading the charge in supporting the infrastructure and growth of the biotechnology market by leveraging its products for use in biotechnology applications.  

    EVG’s NIL solutions can produce a wide range of small structures (from hundreds of micrometers down to 20 nm) on a variety of substrate materials used in biotechnology applications, including glass, silicon and a variety of polymers (e.g., COC, COP, PMMA and PS). Each EVG NIL solution is uniquely suited for different production applications. For example, hot-embossing allows precise imprinting of larger structures as well as combinations of micro- and nanostructures, and is superior when replicating high-aspect ratio features or when using very-thin substrates. UV-NIL provides very-high precision, pattern fidelity and throughput in the nanometer-range. Micro contact printing, which is another NIL option, can transfer materials such as biomolecules onto a substrate in a distinct pattern.


    With its established wafer-scale bonding equipment, EVG can also offer sealing and bonding processes that are well-aligned with NIL structuring technologies. A variety of different bonding options are available, ranging from advanced room-temperature bonding techniques to plasma activated bonding as well as high-quality hermetic sealing and vacuum encapsulation. Examples of typical solutions include EVG’s thermal bonding equipment for glass and polymer substrates, which provides excellent results by enabling high-pressure and temperature uniformities over large areas. EVG also offers its room-temperature selective adhesive transfer technology, which eases incorporation of bio-molecules prior to the encapsulation of the device.


    “EVG has a long history of providing products and solutions for biomedical R&D, having installed the first hot embossing system for emerging bioMEMS and microfluidic research applications more than 15 years ago,” stated Dr. Thomas Uhrmann, director of business development at EV Group. “The knowledge that EVG has built up in this space coupled with our experience in bringing innovative technologies into volume production in other markets has positioned us well to provide proven high-volume manufacturing processes and services to the bio-medical industry to support the production of next-generation biotechnology devices.”


    In addition to equipment and process solutions, EVG also offers prototyping and pilot-line production services to customers out of its cleanroom facilities at its corporate headquarters in Austria as well as its subsidiaries in North America and Japan.


    More information on EVG’s suite of process solutions for the biotechnology and medical device market can be found at www.evgroup.com/en/solutions/microfluidics. In addition, EVG will showcase these solutions at the Lab-on-a-Chip Microfluidics & Microarrays World Congress being held September 26-28 at the Marriott Mission Valley Hotel in San Diego, Calif. Attendees interested in learning more about EVG’s suite of biotechnology solutions are invited to visit the company’s booth C48 throughout the show, as well as attend EVG’s Technology Spotlight presentation during the session “From Technologies to Utility – Applications of Microfluidics/LOAC in Life Sciences and Beyond” on Wednesday, September 28 from 11:45 a.m. to 12:15 p.m. Pacific Time.


    * Note to Editors: The source for this market data is the “BioMEMS: Microsystems for Healthcare Applications 2016” report, released by Yole Développement in April 2016.

  • New wafer alignment and bake modules provide critical capabilities to support wafer bonding for a broad range of new and emerging MEMS manufacturing applications


    ST. FLORIAN, Austria, July 6, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond alignment module that provides sub-micron face-to-face alignment accuracy essential for wafer-level MEMS packaging, and a new bake module that performs critical process steps to achieve outstanding bond quality and performance of encapsulated MEMS devices.

    The addition of these two new modules—coupled with existing capabilities on the highly configurable
    EVG ComBond platform such as room-temperature covalent bonding of engineered substrates—enables customers to meet the wafer bonding requirements for both current and emerging types of MEMS devices. Examples include gyroscopes, microbolometers, and advanced sensors for autonomous cars, virtual reality headsets and other applications.

    “When EV Group introduced the EVG ComBond platform, we set a new standard in high-vacuum wafer bonding by building the product around a modular, highly customizable cluster design concept. This has enabled us to continually expand the capabilities of the platform over time, with applications ranging from advanced engineered substrates, power devices and solar cells to high-performance logic and ‘Beyond CMOS’ devices,” stated Paul Lindner, executive technology director, EV Group. “With the addition of new vacuum alignment and bake modules, those wafer bonding capabilities have been expanded yet again to address the volume manufacturing needs for high-end MEMS devices.”

    Challenges of Scaling MEMS Wafer Bonding into Production

    Many MEMS devices have extremely small moving parts, which must be protected from the external environment. Wafer-level capping can seal a wafer’s worth of MEMS devices in one operation, and these capped devices can then be packaged into much simpler and lower-cost packages. Metal-based aligned wafer bonding is the preferred approach to MEMS wafer bonding, but is challenging to implement due to the high process temperatures involved as well as the presence of oxides that form on the bonding metal layers. As MEMS die and feature sizes decrease, achieving tighter wafer alignment accuracy also becomes increasingly important.

    At the same time, vacuum encapsulation is increasingly needed for certain MEMS devices in order to reduce power consumption caused by parasitic drag, reduce convection heat transfer, or prevent oxide corrosion. Maintaining the required vacuum level for the entire wafer bonding process has been a key challenge for ramping these devices into high-volume production.

    The EVG ComBond platform provides a complete end-to-end high-vacuum environment (10-8 mbar range) throughout all wafer handling, pre-bonding and bonding processes. This modular configuration significantly improves serviceability, as modules can be swapped out without breaking the vacuum level within the cluster or modules and interrupting tool operation.

    New MEMS Wafer Bonding Capabilities

    New to the EVG ComBond platform is the vacuum alignment module (VAM) with wafer clamping, which enables sub-micron face-to-face alignment accuracy based on EVG’s proprietary SmartView® alignment process, as well as backside and IR alignment, in a high-vacuum environment. Also new is the programmable dehydration bake and getter activation module, which accelerates the removal of sticking gas molecules prior to bonding the substrates—resulting in improved bond quality as well as reduced gas pressure in device cavities.

    In addition, the EVG ComBond platform features an optional ComBond Activation Module (CAM), which enables covalent and oxide-free wafer bonding processes at room temperature or low temperatures. Integrated into the ComBond platform, the CAM allows low-temperature bonding of metals, such as aluminum, that re-oxidize quickly in ambient environments—enabling customers to reduce production costs and achieve higher wafer-bonding throughputs.

    The EVG ComBond platform with the new alignment and programmable dehydration bake and getter activation modules is currently available and can be demonstrated at EVG’s headquarters.

    Media, analysts and potential customers interested in learning more about EVG’s suite of wafer bonding solutions, including the EVG ComBond platform, are invited to visit the company’s booth #1017 in the South Hall of the Moscone Convention Center in San Francisco, Calif., at the SEMICON West show on July 12-14.


    More information on the EVG ComBond, including product photos, can be downloaded at http://www.evgroup.com/en/products/bonding/waferbonding/evg_combond/.


    EVG®50 performs high-throughput, high-resolution measurements of critical wafer bonding and lithography process parameters in a flexible, customizable standalone platform

    ST. FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive multi-layer thickness and topography measurement, as well as void detection, in bonded wafer stacks and in photoresists used in optical lithography. The system measures layers down to two microns in thickness, can inspect up to one million points, and achieves throughputs of up to 55 300-mm wafers per hour. This combination of extremely high resolution and high throughput provides cost-efficient full-wafer inspection that enables device manufacturers to improve their wafer bonding and lithography processes, as well as achieve higher yields.

    Dr. Thomas Glinsner, corporate technology director at EV Group, noted, "The semiconductor industry is witnessing a trend toward total control and monitoring of all production processes. Mid-end-of-line and back-end packaging processes face tighter process constraints at levels previously seen only in front-end-of-line wafer processing. This is creating an urgent need for highly accurate in-line metrology that can provide critical process data quickly and cost-effectively. The EVG50 is an important addition to our suite of metrology solutions that achieves these goals at speeds and resolutions that far surpass those of competitive systems."

    Building on a Legacy of Widely Adopted Metrology Solutions

    The standalone EVG50 system was developed based on the company’s existing in-line metrology module (IMM), which is available as an option in EVG’s line of 300-mm process equipment and has been widely implemented in high-volume manufacturing. The EVG50 complements the company’s versatile EVG®40NT measurement system, which is the industry standard for bond overlay inspection, to meet increased customer demand for full-area layer thickness and topography measurement in critical applications. The EVG50’s high throughput and unparalleled accuracy and repeatability, even at ultra-high resolutions, enables cost-effective, 100-percent inspection of production wafers, resulting in improved process control.

    The EVG50’s versatility allows it to measure coating thickness for lithography as well as wafer bow and warpage, and make void inspections for a bonded wafer stack on the same system, while its low-contact edge handling enables particle-free, full-area wafer inspection. Another key benefit of the EVG50 is its flexibility. Leveraging a multi-sensor measurement mount, the system can be customized for different thickness ranges and substrates to address a wide variety of customer requirements. Its self-calibration capability also allows for better system reproducibility and productive uptime.

    Media, analysts and potential customers interested in learning more about EVG’s suite of metrology solutions, including the EVG50, are invited to visit the company’s booth #1017 in the South Hall of the Moscone Convention Center in San Francisco, Calif., at the SEMICON West show on July 12-14.

    More information and photos on EVG’s suite of metrology solutions, including the EVG50, can also be found at http://www.evgroup.com/en/products/bonding/inspectionsystems/evg50/.


    Automated Production Fusion Wafer Bonding System combining several performance breakthroughs to surpass ITRS requirements for wafer bonding...

  • The GEMINI®FB XT, EVG’s next-generation fusion wafer bonding platform, clears several key hurdles to the industry’s adoption of 3D-IC/TSV technology in high-volume manufacturing. A three-fold improvement in wafer-to-wafer bond alignment accuracy, combined with a 50 percent increase in throughput over the previous industry benchmark platform, supports IC manufacturers’ efforts to move wafer stacking upstream in the manufacturing value chain from mid-end-of-line (MEOL) and back-end-of-line (BEOL) processing to front-end-of-line (FEOL) processing.


    • Incorporates EVG’s SmartView® NT2 bond aligner, which enables wafer-to-wafer alignment accuracy below 200 nm (3σ)
    • Accomodates up to six pre-processing modules such as Clean Modules, LowTemp™ Plasma Activation Modules, Alignment Verification Module and Debond Module
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module) and optional FSS (Foup Storage System)
    Fully-integrated EVG® SmartNIL™ UV Nanoimprint Lithography System...

  • The HERCULES NIL, a fully-integrated UV nanoimprint lithography track solution for wafers up to 200 mm, is the latest addition to EVG’s NIL product portfolio. Based on a modular platform, the HERCULES NIL combines EVG’s proprietary  SmartNIL imprinting  technology  with  cleaning, resist coating and baking preprocessing steps. This turns the HERCULES NIL into a “one stop shop”, where bare wafers are loaded into the tool and fully processed nanostructured wafers are returned.


    • Enables mass manufacturing of  40 nm structures
    • Supports a wide range of structure sizes and shapes
    • Optional mini-environment and climate control for best process stability and yield
    • Optimized modular platform for high throughput
    • Low cost of ownership due to multiple-use soft stamp technology
    • Includes working stamp manufacturing capability
    • Master template lifetime comparable to masks used for optical lithography
    • Fastest curing times due to high-power lamp house
    • Easy to operate and maintenance-friendly
  • EVG®850TB/DB (XT Frame)
    Automated Temporary Wafer Bonding / Debonding Systems. Next-generation thin wafer processing for high-volume 3D IC manufacturing, based on EVG’s new XT Frame equipment platform...

  • Built on the company’s XT Frame platform, the new EVG®850TB/DB systems double the throughput over EVG’s previous-generation, industry-benchmark equipment platform to up to 40 stacks per hour. The systems enable the highest productivity, repeatability and yields in thin-wafer processing. Designed for EVG’s open materials platform approach, the EVG®850TB/DB support a wide range of adhesives from various materials suppliers, providing customers with the most flexible choice of temporary bonding materials.


    • Highly efficient continuous mode operation (zero idle time)

    • Ultra-fast handling system

    • Up to nine process modules

    • Up to 4 FOUP load ports

    • Up to 10 additional FOUPS in a Local Foup Storage System

    • In-line metrology module option enables real-time monitoring of bonding/debonding process

  • EVG®150XT
    Automated Photoresist Resist System for logic and memory advanced packaging applications...

  • The EVG®150 XT combines EVG’s expertise in lithography with the newly developed XT platform to enable the industry’s first high-volume-manufacturing resist processing system for mid-end and back-end interconnect applications, including through-silicon via (TSV) formation, wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D-IC packaging. The advanced system is designed for processing resists, spin-on dielectrics and thick films. The EVG®150XT features nine process modules that can operate simultaneously for multi-parallel wafer processing.


    • Supporting wafer sizes up to 300 mm
    • Coating of thick- and thin-film resists from below 1 µm to over 100 µm
    • Available options include spin coat, spray coat, NanoSpray™, develop, bake/chill/vapor prime and Inline metrology modules
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
    • User-friendly, flexible software
  • EVG® ComBond®
    High-Vacuum Wafer Bonding Platform enabling emerging MEMS applications as well as electrically conductive and oxide-free covalent bonds at room or low temperatures...

  • The EVG ComBond marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. Typical application areas range from advanced engineered substrates, stacked solar cells and power devices to high-end MEMS packaging, high-performance logic and “Beyond CMOS” devices.

    The highly flexible platform supports multiple modules, including activation, bake, optical alignment and thermo-compression wafer bonding modules for metal-based bonding. EVG’s wafer activation technology and high-vacuum handling and processing allow the formation of covalent bonds at room temperature for engineered substrates and facilitates the bonding of heterogeneous materials as well as the formation of electrically conductive bond interfaces. The high-vacuum technology also enables low-temperature bonding of metals, such as Aluminum, that re-oxidize quickly in ambient environments.


    • High Vacuum Covalent Bonding
      • In-Situ Oxide removal
      • Superior Surface Properties
      • Conductive Bonding
    • Room Temperature Process
      • Multiple Materials Combination
      • Stress Free Bond Interface
      • High Bond Strength 
    • Modular System for HVM and R&D 
      • Flexible Configuration
      • Fully Automated
      • Easy Serviceability
  • EVG®50
    Automated Metrology System for industry leading high-accuracy measurements...

  • The EVG 50 (fully automated stand alone tool) and the Inline Metrology Module (integrated in EVG’s high volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool’s application range covers multilayer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement and meets the most demanding requirements of the yield driven semiconductor industry.


    • Industry leading throughput and resolution multilayer metrology

      • Multilayer thickness mapping

      • Bond interface inspection

    • Low contact edge handling

      • Particle free

      • Full-area accessible front and back side

    • Self calibration for better system reproducibility

      and more productive time

    • Various output formats

    • 100% production inspection for film thickness and thickness variation


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