SUSS MicroTec

Schleissheimer Str. 90
Garching,  85748

Germany
http://www.suss.com
  • Booth: 544


Looking forward to meet you at Semicon Europa, booth #544

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint Lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.


 Press Releases

  • Garching, September 6, 2016 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, today announced the launch of its new generation of the fully automated ACS300 platform. The modular system of the ACS300 Gen3 is specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip and 3D packaging.

    The tool addresses the needs of a highly competitive and cost-sensitive market. Efficient module stacking allows for the smallest footprint for a system with eight coaters and developers on the market, saving costly cleanroom space. The three-level modular system delivers high yield and throughput by fast and precise robots, intelligent scheduling algorithms and a highly advanced monitoring system. The ACS300 Gen3 provides for simultaneous 200 mm and 300 mm wafer processing without the need for a mechanical changeover. In addition, the tool can be equipped to handle 330 mm and warped wafers with a warpage of up to 10mm. The ability to process multiple wafer shapes and sizes as well as various coat and develop materials makes the platform an efficient all-in-one solution. State-of-the-art chemical-saving features address economic as well as ecological concerns, working in line with even the most rigid sustainability standards.

    “The ACS300 Gen3 is our new flagship for the advanced packaging market. Having worked in close collaboration with our customers, we have created a platform that really excels. We are very excited to present some new groundbreaking functions. The ACS300 Gen3 stands for high process stability, repeatability and yield. For example, it has more sensors for logging and control than any coating system SUSS MicroTec has ever produced”, says Gary Choquette, General Manager of the Coater/Developer product line. “With this brand new generation of the ACS300, we supply our customers with a high-quality, state-of-the-art tool at a very favorable cost of ownership.”

     

    About SUSS MicroTec

    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com

  • Garching, August 18, 2016 SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, today announces the successful certification to the ISO 14001:2015 norm. This international standard sets out the criteria for an environmental management system. This standard includes numerous requirements on environmental management, relevant product characteristics, environmental indicators and performance evaluation.By obtaining the ISO 14001:2015 certification - as a complement to the ISO 9001 certification - the company upgraded its comprehensive management system. Both certifications reflect the strong commitment to the environment and to quality. For SUSS MicroTec it was also important to formally document this awareness by obtaining the ISO certification.

    The auditors were at both German company sites in Garching and Sternenfels for several days. They questioned and verified the practical work as well as the results in the company. Finally, they recommended granting the Company the certification. By harmonizing environmental objectives with the high standards of quality, service and efficiency, SUSS MicroTec once again shows its high commitment to social responsibility and proves that environmental protection and economic success do not exclude one another.

  • Garching, June 30, 2016 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today. The new generation of SUSS MicroTec’s semi-automated Mask and Bond Aligners extends its capabilities by major improvements in alignment accuracy, ergonomic design and further reduced cost of ownership.  With the launch of the fourth generation, SUSS MicroTec introduces a new platform system. The two platform types are configured differently and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series for advanced high-end processes. By moving to this new platform concept, SUSS MicroTec further optimizes the Mask Aligner product portfolio to better align with customer requirements.

    Main application of SUSS MicroTec’s MA/BA Gen4 series is full-field lithography in Academia, MEMS, 3D Integration and the Compound Semiconductor market. It furthermore handles processes like bond alignment, fusion bonding and SMILE imprint. In addition to standard wafer processing the MA/BA Gen4 series reliably processes delicate substrates, such as fragile, warped or uneven surfaced wafers.

    “Our new manual Mask Aligner series sets a high benchmark regarding cost efficiency, user friendliness and leading edge process results” said Dr. Per-Ove Hansson, CEO SUSS MicroTec. “With this new platform concept, we further align with different customer requirements – the MA/BA Gen4 for standard lithography processes or the leading edge MA/BA Gen4 Pro for small-series production and more demanding solutions, e.g. our Soft Conformal Imprint Lithography (SCIL) solution.”

  • Garching, May 19, 2016 SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the LI Series – a new Surface Laser Imaging platform as pre-announced on May 4, 2016.

    The highly versatile technology of the LI for laser surface processing ranges from sub micrometric pattering of resist coated substrates to micro-ablation, photo-chemistry treatment as well as metrology.

    The patterns, defined by a CAD process, are transferred by accurately moving the targeted substrates underneath a focused and scanning laser beam. In addition, the Laser Imager configuration is highly customizable, to best fit the specific requirements of each user. The technology supports substrate sizes from small pieces up to 300 mm, and it reaches a resolution down to 0.8 µm. Multi-layer alignment is possible via both top and bottom side alignment optical systems. Beside the 405 nm GaN laser for standard thin resist lithography processes, a second laser source can also be added to additionally address diverse processes such as, among other, thick resists like SU8, and infrared sensitive materials.

    Core advantage of the Laser Imager is its flexibility, making it suitable for the various requirements of academic and industrial R&D facilities. The main applications include a wide variety of nano- and 3D structuring for high resolution wafer lithography, micro-optical components, sensors, microfluidic devices, and photo mask manufacturing.

    “With the Surface Laser Imaging platform, we add a tool to our product portfolio that expands our existing exposure equipment set towards higher resolution requirements for leading edge applications.” says Dr. Per-Ove Hansson, CEO of SUSS MicroTec AG. “With this addition, we are enhancing our leadership position and offering the most comprehensive set of products and technologies for the lithography R&D market.”

  • Garching, May 4, 2016 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, today announces the extension of its technology range by leading-edge laser surface imaging. This technology has been developed through an external partner in Europe and the first SUSS product will be launched in Q2 2016.

    This process is well-suited not only for resist structuring, but also for lithography mask production, micro-ablation, and high-resolution metrology. The highly flexible technology is suitable for the various requirements of academic and industrial R&D laboratories. Its main fields of application include submicron- and 3D structuring, microfluidics, mask manufacturing and the definition of micro-optical components.

    “With laser surface imaging, we aim to strengthen our leadership position in the lithography segment, in particular in the attractive MEMS market.” says Dr. Per-Ove Hansson, CEO of SUSS MicroTec. “By initially targeting the R&D market, we expect order intake and sales to be in the low million Euro range for the time being. Longer term we aim to develop this technology further in order to address higher volume manufacturing applications as well.”


 Products

  • ACS300 Gen3
    The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments in Advanced Packaging. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes....

  • One tool for all advanced packaging applications

    The ACS300 Gen3 addresses the needs of the highly competitive and cost-sensitive advanced packaging market. The platform excels in process versatility and serves as all-in-one coat and develop solution. State-of-the art features offer an attractive cost of ownership. Efficient module stacking allows for a very small footprint, saving costly cleanroom space. High yield is achieved by fast and precise robots, intelligent scheduling algorithm and an advanced monitoring system. The tool is used for packaging applications such as wafer-level chip-scale, fan-out wafer-level, copper pillar flip-chip and 3D packaging.

    HIGHLIGHTS
    + Smallest eight coater/developer system on the market
    + Various chemical-saving features
    + Highly flexible process configuration
    + Dual robot wafer handling for high throughput
    + Monitoring of all relevant process parameters

  • MA/BA Gen4 series
    The MA/BA Gen4 series is a semi-automated mask and bond aligner. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production....

  • Compact Aligner Platform for Research and Low-Volume Production

    The MA/BA Gen4 series is setting a new benchmark in full-field lithography for academia, MEMS & NEMS, 3D integration and compound semiconductor markets. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production. It is also prepared to handle processes like bond alignment, fusion bonding and SMILE imprinting. Processes developed on the MA/BA Gen4 series can be quickly transferred
    onto SUSS MicroTec‘s automated mask aligner platforms for high-volume production.

    HIGHLIGHTS
    + Low cost of ownership
    + High level of automation
    + Superior top-side, bottom-side, and infrared alignment technologies
    + Highly precise face-to-face microscope unit
    + Unique illumination optics for maximum flexibility
    + Handles multiple substrate shapes and sizes
    + Reliable processing of fragile, warped or uneven surfaces
    + Enhanced ergonomic design

  • LI series
    Direct Laser Writing for Fast Prototyping in Academia and Industrial R&D Applications...

  • Direct Laser Writing for Fast Prototyping in Academia and Industrial R&D Applications

    The LI series equipment is designed for fast prototyping in academic and industrial research. It is based on the application of proven laser technology to maskless lithography processes. A GaN laser beam directly writes to substrate surfaces reaching resolutions down to 0.8 μm and below. The laser imager provides additional functionalities such as grey-scale lithography, surface treatment and diagnostics – all adding up to the advanced process versatility the LI laser writer offers. Areas of application are MEMS, microfluidics and microoptics.

    HIGHLIGHTS
    + Excellent resolution features
    + High process flexibility
    + Low cost of ownership
    + Fastest prototyping via maskless lithography
    + Offers additional metrology functionalities
    + Maintenance-free
    + High automation for enhanced throughput

  • XB8
    The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly, which make the system perfect for use in research and development....

  • Universal High-Force Wafer Bonder

    The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.
    The XB8 wafer bonder has a closed process chamber with an automatic loading function. During loading, the chamber is flooded with nitrogen to ensure the best possible level of cleanliness. The high level of automation minimizes the influence the operator has on the process result. The thermal decoupling of the heater from the actual bonder chamber enables a process temperature which can be reproduced precisely, combined with a high repeat accuracy of the bonding force.

    HIGHLIGHTS
    +
    Flexibility in process development
    + Process stability
    + High yield

     


Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".