SPTS Technologies (An Orbotech Company)

Ringland Way
Newport, Gwent,  NP18 2TA

United Kingdom
http://www.spts.com
  • Booth: 1115


SPTS invites you to visit our booth #1115 at SEMICON Europa.

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing and UV Laser Drilling for through mold vias.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information please visit www.spts.com and www.orbotech.com.


 Press Releases

  • SPTS Technologies

     

     

     

    Orbotech’s SPTS Technologies Adds Rapier-300S to its MosaicPlatform for Plasma Dicing of 300mm Wafers on Taped Frames

    Rapier-300S Overcomes Singulation Challenges of Ultra-Small and Ultra-Thin Devices in Volume Production

          NEWPORT, UK, July 7, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, has introduced the Rapier-300S plasma etch module, the latest addition to its Mosaicplasma dicing platform. The Rapier-300S singulates 300mm wafers on 400mm taped frames, and offers significant throughput and yield benefits for manufacturers of ultra-small and ultra-thin devices. Using SPTS’s industry leading deep reactive ion etch (DRIE) technology, the Rapier-300S offers the tight process control and fast etch rates necessary to achieve the high yields and throughput required for this cost sensitive step.

         "As devices continue to shrink, singulation by plasma etching offers considerable benefits for die quality and strength as compared to traditional dicing solutions," stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. "With wafer thicknesses trending below 50μm, conventional dicing methods are reaching their limits. Ultra-small and ultra-thin devices like RFID chips or fragile devices like MEMS are more susceptible to damage from the vibration and chipping caused by mechanical saws, or from the heat caused by lasers. Plasma dicing is a purely non-contact chemical process, thus offering a far less damaging method of singulating devices when they are in their most valuable state. With customers already qualifying devices on 300mm, and in volume production on 150mm and 200mm, our plasma dicing solutions are well positioned to be the benchmark technology for fabs seeking to increase throughputs and yields for small or thinned fragile die."

        The Rapier-300S is a silicon DRIE module, designed specifically for dicing of 300mm wafers mounted on 400mm frames. It builds on SPTS’s experience in plasma singulation of 150mm, 200mm and 300mm wafers. Unique aspects of SPTS’s plasma dicing technology include the use of SPTS’s patented Claritasend-point detection system, which provides the earliest possible detection of the lane clearing, allowing the use of patented "bias pulsing" techniques to prevent lateral damage of the die sidewall.

        The Rapier-300S can etch die of any shape with dicing lanes below 10μm and accommodates wafer thicknesses up to and including full wafer thickness. For the smallest die, for example RFID devices (at~0.04mm2), the adoption of narrow dicing lanes could provide up to 80% more die per wafer, at much higher throughputs since all dicing lanes are etched in parallel. Plasma dicing also gives device designers much greater flexibility with regards to fundamental die position/shape/size, removing guard rings and positioning of die/test groups, to make better use of the wafer area.

        SPTS Technologies will be showcasing the Rapier-300S, at SEMICON Europa, Booth No. 1115 on October 25 - 27,  Alpexpo, Grenoble, France.

        To learn more about SPTS’s Rapier-300S, the Mosaic plasma dicing platform, and full range of industry leading etch and deposition process solutions or to arrange a meeting with a member of our team, email enquiries@spts.com.

    ####

    About SPTS Technologies

    SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

    COMPANY CONTACTS:

    Destanie Clarke
    Senior Director, Marketing Communications
    SPTS Technologies

    Tel: +44 7951 203278 Destanie.Clarke@orbotech.com

    Tally Kaplan Porat
    Head of Corporate Marketing
    Orbotech Ltd.
    Tel: +972 8 942 3603 Tally.KaplanPorat@orbotech.com

  • SPTS Technologies

     

     

     

    Orbotech’s SPTS Technologies Presented with Supplier Excellence Award by Qorvo

    SPTS Receives Special Honor for Outstanding Support and Commitment to Excellence

        Newport, United Kingdom, 29 June, 2016 – SPTS Technologies, an Orbotech company, and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced it was given a Supplier Excellence Award by Qorvo in appreciation of SPTS’s hard work, support and commitment to excellence.

        "Qorvo needed to quickly and cost-efficiently increase production capacity of their Richardson, Texas line in order to meet customer demand," said Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. "They set some challenging timescales, but by adapting our manufacturing and installation processes, we were able to meet their requirements on schedule and to specification. This Qorvo Supplier Excellence Award recognizes the results achieved through hard work and close collaboration between our teams. Delighting our customers is the goal of all of us at SPTS, and we’re extremely proud of the quality and performance of the teams across all disciplines that contributed to this success."

        Howard Witham, Vice President, Texas Operations, Qorvo, said, "We have been impressed with the ability of SPTS to achieve the promised delivery deadlines to meet our planned ramp, with the flexibility to accommodate late changes, while also providing cost-savings associated with re-configuring existing toolsets and efficient hand-over of all the tools. Open and clear communication between us has been key at all stages from PO to process qualification. SPTS exemplifies what we need in a business partner, and I am very pleased to present this Supplier Excellence Award to SPTS."

        Qorvo is a leading provider of RF solutions for mobile, infrastructure and defense applications, with a broad portfolio of RF technologies. Formed from the merger of RFMD and TriQuint, Qorvo has more than 7,000 global employees dedicated to delivering solutions for everything that connects the world. SPTS Technologies is a preferred supplier to Qorvo, and the Sigma fxP PVD solution is the process of record (POR) for depositing piezoelectric films.

        To learn more about SPTS and the full range of industry leading etch and deposition process solutions, or to arrange a meeting with a member of our team, email enquiries@spts.com.  

    ####

    About SPTS Technologies

    SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

    COMPANY CONTACTS:

    Destanie Clarke
    Senior Director, Marketing Communications
    SPTS Technologies

    Tel: +44 7951 203278 Destanie.Clarke@orbotech.com

    Tally Kaplan Porat
    Head of Corporate Marketing
    Orbotech Ltd.
    Tel: +972 8 942 3603 Tally.KaplanPorat@orbotech.com

  • SPTS Technologies

     

     

     

    Orbotech Inkjet™ 600 Selected by Amkor Technology for System-in-Package Applications

    High Accuracy Inkjet Printing of 3D Underfill Dams Offers Greater Flexibility and Lower Cost of Ownership in Volume Production

    YAVNE, ISRAEL, July 11, 2016 | ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment enabling the transformation of the global electronics manufacturing industry, today announced that its Orbotech Inkjet™ 600 system has been selected by Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services. By using Orbotech Inkjet 600 to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products, Amkor aims to maximize its manufacturing flexibility, increase its feature position accuracy and reduce its design-to-manufacturing lifecycle.

    "Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging," said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. "We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers. We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes. Our Orbotech Inkjet 600 offers device manufacturers unprecedented flexibility in product development, reduced cycle times and lower overall cost of ownership."

    "Amkor's emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings," commented JuHoon Yoon, Amkor’s R&D Vice President in Korea. "By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers."

    Underfill dams prevent leakage between active and passive components and are an essential process in SiP packaging for both device and sub-component substrates. With its high-accuracy printing capability, the Orbotech Inkjet 600 enables the formation of tall underfill dams in a single step with real-time local alignment correction for tighter integration of components. This not only leads to a shorter process by replacing existing cumbersome, subtractive processes, but also significantly lowers manufacturing costs.

    Orbotech, together with SPTS Technologies, an Orbotech company, will be exhibiting at SEMICON Europa, Booth No. 1115 from October 25-27 in Grenoble, France.

    ####

    About Orbotech Inkjet™ 600

    Orbotech Inkjet™ 600 provides cost-effective, high quality additive printing solutions for IC packaging production. Based on Orbotech’s advanced DotStream Pro Technology™, the Inkjet 600 prints fine lines and uniform thin layers at any angle and on a wide range of materials. Its sophisticated automatic measurements and scaling modes enable market-leading registration and accuracy. The Orbotech Inkjet 600 offers flexible, cost-efficient solutions for IC packaging applications, including tall, high-aspect ratio 3D dams (ratio of 1:4), accurate isolation layers, IC units marking and serialization.

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com and www.spts.com

     

    COMPANY CONTACTS:

    Rami Rozen
    Director of Investor Relations

    Orbotech Ltd.
    Tel: +972 8 942 3582

    Investor.relations@orbotech.com

    Tally Kaplan Porat
    Head of Corporate Marketing
    Orbotech Ltd.
    Tel: +972 8 942 3603 Tally.KaplanPorat@orbotech.com


 Products

  • Delta® Deposition Systems
    SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging...

  • PECVD

    • Wafer sizes from 75mm to 300mm
    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
    • Up to 10 gas lines and optional on-board liquid delivery system
    • Mixed frequency plasma capability for stress tuning
    • Active platen cooling for critical, low temperature [<175°C] packaging applications
    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

    Markets Served

    MEMS applications demand a wide range of dielectric film types,SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers

    Advanced 3D-IC applications, SPTS offers low temperature [<175°C] processes compatible with 300mm bonded substrates. Applications include via-last TSV liner and via-reveal passivation.

    SPTS is the only PECVD provider who can deposit electrically robust, stable nitride and oxide films at <200°C

    RF-IC semiconductor applications, SPTS develops processes and hardware for today’s production needs and Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

    Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers

  • Omega® Etch Systems
    SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors...

  • Plasma Etch

    ICP Etch
    The Omega® ICP process module uses a patented high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the market leader for compound semiconductor applications.

    Dielectric Etch
    SPTS’s Omega® SynapseTM process module is an ICP-based high density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.

    The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10.

    Si DRIE
    Install base of over 1000 DRIE process modules, SPTS’s market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

  • Sigma® Deposition Systems
    The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD...

  • Sigma Metal Deposition Technologies

    Standard PVD – conventional sputter modules for low topography features

    Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

    C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

    Advantages

    Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.

    Planar target with full face erosion,avoids re-sputtering, reduces particle contamination and improves target life

    Rapid target change (<5mins), with common magnetron increases uptime

    Reliable handling of fragile, thinned or bowed wafers

    "Super Uniformity" option available for specialist applications

    Multi-wafer degas to increase throughput for long (low temp) degas applications

    Common software for 200mm and 300mm systems - ease of use

    Markets Served

    MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC


Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".