3D-Micromac AG

Technologie-Campus 8
Chemnitz,  D-09126

  • Booth: 1125

3D-Micromac AG - Micromachining Excellence
3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technical and technological level.
3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex projects.
3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true innovation.

 Press Releases

  • Company also expands North American operations with new applications lab and service/support facility to meet growing customer demand for TLS-Dicing™ technology

    3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced that its microDICE™ laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes. Leveraging 3D-Micromac’s proprietary TLS-Dicing™ technology, the microDICE system provides fast, clean and cost-effective dicing of wafers used for advanced semiconductors and power device applications. Its unique approach uses thermally induced mechanical stress to separate brittle semiconductor materials such as silicon, silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs).

    [Textfeld: The microDICE™ laser micromachining system from 3D-Micromac supports volume production of high-power diodes.] TLS-Dicing is a contact- and residue-free process that provides significantly higher throughput, higher yields and greater functionality compared to traditional die-separation technologies. For example, throughput is up to 30X greater compared to saw dicing. The technology also provides lower cost of ownership than other approaches. A forceless and contactless machining process, TLS-Dicing eliminates tool wear and requires no expensive consumables for surface cleaning—resulting in cost savings of up to an order of magnitude or more.

    “While significant time and resources are invested in the front-end of semiconductor manufacturing to produce a completed product wafer, back-end wafer processing has historically been viewed as a necessary evil,” stated Tino Petsch, CEO of 3D-Micromac. “That’s all changed with the adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions, larger-size substrates, and new packaging technologies like 3D-stacking. Back-end process steps such as wafer dicing are evolving as critical value-add process steps that not only ensure, but also further enhance, device yields. Using our TLS-Dicing technology, the microDICE system provides superior wafer dicing performance over other approaches while considerably reducing the dicing cost per wafer. Our technology has been proven in the photovoltaic and other industrial markets, and we are pleased to bring the benefits of it to the semiconductor and power device manufacturing industry.”

    3D-Micromac also announced that it is expanding its global infrastructure with the opening of its new 3D-Micromac America headquarters in the heart of Silicon Valley, in San Jose, Calif. Serving as both an applications lab and sales and support facility, the office marks the company’s first major presence in North America and will enable 3D-Micromac to better meet rising customer demand for its laser micromachining products across all of its served markets, including solar, semiconductor, MEMS, display and smart glass.

    According to Daniel Weber, sales and business development manager for 3D-Micromac America, “With our new regional headquarters and applications lab, 3D-Micromac can offer our North American-based customers a first-class network of sales and support services for our laser micromachining systems. Providing customer evaluations, applications development, and small-scale contract manufacturing is a unique offering among wafer dicing technology suppliers. We look forward to delivering all of these capabilities to our existing, new and potential customers.”

    3D-Micromac America, LLC is located at 2151 O’Toole Ave, #40, San Jose, CA 95131, Tel. +1-408-850-7252.

    Other key advantages of 3D-Micromac’s microDICE system with TLS-Dicing versus traditional separation technologies include:

    • No chipping or micro cracks – excellent cleaving results with no defects
    • Particle-free – no debris discharge since the substrate is only heated and not vaporized
    • Minimal heat-affected zones – other laser dicing approaches can generate unwanted heat that causes damage to the area around the site of the laser
    • Increased yields – results in zero kerf (width of cut made by saw dicing), which leads to narrower scribe lines and frees up more real estate on the wafer for making product. It also has no negative impact on the electrical performance of the device, and in some applications it can improve performance, such as reducing leakage current on power diodes
    • Fewer process steps – eliminates need for protective coating and adjacent cleaning process
    • Excellent back-side metal separation – no peeling or delamination
    • Processes up to 300-mm wafer substrates


    Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser micromachining solutions, including microDICE, are invited to visit the company’s booth #6452 in the North Hall of the Moscone Convention Center in San Francisco, Calif., at the SEMICON West show on July 12-14.

    More information on the microDICE system can be downloaded at:


    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com


  • "microDICE"
    TLS-Dicing™ System for Separation of SiC Wafers...

  • 3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality while increasing yield and process throughput. This is particularly true for silicon carbide (SiC) substrates, which are hard and brittle.
    microDICE™ offers:

    • Significantly higher throughput, with dicing speeds up to 300 mm/s
    • Minimal cost of ownership
    • The ability to produce more dies per wafer by reducing street width
  • "microCELL TLS"
    On-the-Fly Cell Cutting using Thermal Laser Separation...

  • 3D-Micromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells.

    The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.
    microCELL™ TLS offers:

    • ‚On-the-fly laser processing with unbeatable
      cost-benefit ratio
    • One-pass contactless dicing process
    • High throughput > 3,800 wph on single lane
    • Dicing speed up to 300 mm/sec
    • Low cost of ownership and CAPEX
    • Inline integration into existing production lines

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