Come and learn how to enhance thin wafer yield with BRS
BRS develops optical and electrical measurement systems for inline quality assurance with focus on the thin wafer market.
While this market is growing, problems have increased because wafers are getting thinner and thus more likely to break. This breakage is caused by broken and chipped wafer edges which may result in functional failure or total wafer breakage. Production processes as well as production equipments responsible for these kinds of defects have to be identified and improved.
This is why BRS focuses on quality assurance for the thin wafer production by providing their patented inline wafer edge inspection system which identifies damaged wafers automatically and simulatenously keeps throughput high.
In fact BRS helps semiconductor manufacturers to save precious inspection time, increase equipment uptime and enhance yield.
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