Bernin, FRANCE (May 3rd, 2016) – CORIAL, a France-based provider of plasma etching and deposition equipment for R&D, semiconductor compounds, MEMS and LED industries, announced launching COSMA Pulse - a new software enabling pulsed or time-multiplexed processing on conventional dry process tools.
The French company has said it has found a way to add new capabilities (pulse of process parameters) to conventional dry etching and PECVD systems to realize DRIE-Bosch processing, Atomic layer etching (ALE) and/or Atomic layer deposition (ALD).
Developed with the R&D market in mind, COSMA Pulse can control and pulse simultaneously and independently from each other all process parameters, including gas flow rate, working pressure, RF power, LF power, or virtual process parameters.
“We are proud to announce the first successful demonstration of COSMA Pulse on a 200 mm ICP-RIE system”, said Jean-Pierre Roch, R&D Manager at CORIAL. For this demo, CORIAL has chosen the DRIE-Bosch – a classical process which alternates repeatedly etching and passivation steps to achieve deep anisotropic etching of silicon structures. DRIE-Bosch is the cornerstone of MEMS, advanced packaging and power devices manufacturing flows. According to Jean-Pierre Roch “COSMA Pulse, with adequate electronic controller, will deliver very fast process step switching from 10 ms for a single process step up to 1 min”.
This software ensures that the wide range of dry etching & deposition techniques from continuous wave plasma to pulsed processing can be realized in conventional ICP-RIE and PECVD tools.
COSMA Pulse expands CORIAL available market, gives customers alternative options for their etching processes”, said CORIAL Marketing Manager Elsa Bernard-Moulin. “This demonstration is just a taste of the capabilities of COSMA Pulse. Soon, we will be letting you see true Atomic Layer processing on our conventional ICP-RIE tool.”
For more information, please contact Elsa Bernard-Moulin at firstname.lastname@example.org
CORIAL is a manufacturer of plasma etching and deposition equipment which contributes to innovation in wafer processing for the semiconductor industry. CORIAL addresses a range of end-market applications including MEMS, LED, Advanced Packaging, Failure Analysis, and Wireless Devices. The technologies offered by CORIAL include RIE, ICP, ICP-CVD, and PECVD. With unique features such as precise process control for damage free etch, stress free deposition, or in-situ plasma reactor cleaning for the highest industry uptimes, CORIAL is committed to deliver the highest repeatability with the lowest cost of ownership.
CORIAL equipment is designed and manufactured in France. Sales and support are provided worldwide through a network of 11 local offices and agents.