CORIAL SAS

266 chemin des Franques
Bernin,  38190

France
http://www.corial.net/
  • Booth: 915


Welcome!

CORIAL is a manufacturer of plasma etching and deposition equipment which contributes to innovation in wafer processing for the semiconductor industry. CORIAL addresses a range of end-market applications including MEMS, LEDs & OLEDs, Advanced Packaging, Failure Analysis, and Wireless Devices. 

You are exclusively invited to join us at the CORIAL booth #915 to experience our latest technology and product innovations including:

  • The new-generation of Corial 210IL system with leading-edge etch processes forhard materials DRIE applied to MEMS, packaging and microfabrication 
  • COSMA Pulse, the process control software for atomic layer processing using conventional dry etching and PECVD systems
  • The Corial 210D, a cost-effective and versatile ICP-CVD system for various R&D projects
  • New process data for ICP and PECVD technologies on 200 mm systems


 Press Releases

  • Bernin, FRANCE (21 Septembre, 2016) – CORIAL, fabricant Français de machines de dépôt et gravure par technologie plasma pour les marchés du semi-conducteur, des MEMS, des LEDs et de la R&D, annonce la sortie de sa nouvelle génération de machine de gravure 200 mm.

     

    Depuis sa création, CORIAL a mis en place une politique produit basée sur l’amélioration continue des machines à son catalogue. « Avec cette nouvelle génération de machine ICP-RIE 200 mm, nous permettons à nos clients actuels ainsi qu’à nos futurs clients d’avoir accès à une gamme élargie de procédés de gravure de matériaux, notamment la gravure profonde (> 100 µm) de matériaux durs. » s’est réjoui Elsa Bernard-Moulin, Responsable Marketing chez CORIAL.

    La gravure profonde de silicium, par le procédé Bosch ou par le procédé cryogénique, est devenue une étape cruciale pour des applications telles que les MEMS (micro-electro-mechanical systems), l’optique intégrée, ou encore le packaging de dispositifs. Le défi principal consiste à graver des structures microniques en profondeur, tout en conservant un profil de gravure vertical, une bonne uniformité de gravure et un rapport d’aspect élevé. Obtenir de telles structures dans des matériaux durs tels que le verre, le carbure de silicium, le saphir ou le niobate de lithium pourrait donner lieu à des possibilités inattendues dans les domaines des MEMS, du packaging et des dispositifs semi-conducteurs de puissance.

    « Nous avons amélioré notre machine de gravure en l’équipant notamment de sources ICP et RF plus puissantes, d’un liner amovible, d’un système de pompage plus performant, et d’une optimisation du système de refroidissement des substrats. Ces évolutions de notre machine ICP-RIE, associées au savoir-faire de notre équipe de R&D, nous ont permis de développer des procédés de gravures profondes de matériaux durs rapides et répondant aux exigences du marché. » a déclaré Elsa Bernard-Moulin.

     

    Exemples de performances obtenues pour la gravure profonde de matériaux durs

    Matériau

    Vitesse de gravure (µm/min)

    Profondeur de gravure (µm)

    Sélectivité

    Verre

    0.5 à 1

    > 100

    > 20

    Carbure de silicium

    1.5 à 2

    > 100

    > 25

    Niobate de lithium

      > 0.3

    > 100

    > 10

     

     

     

     

     

     

     

    Pour obtenir de plus amples informations, merci de contacter Elsa Bernard-Moulin, Responsable Marketing: e-bernard-moulin@corial.net

     

    A propos de CORIAL

    La société CORIAL est spécialisée dans les techniques de dépôt et gravure par plasma. Elle a pour objet d’étudier, de concevoir et de réaliser des équipements de gravure et dépôt par plasma dédiés à la R&D ainsi qu'à la production pour l'industrie du semi-conducteur, des LEDs ainsi que les industries connexes. Développer et mettre en œuvre les procédés appliqués à ces équipements afin d'en tirer les meilleures performances en adéquation avec les besoins des industriels est le cœur de métier de CORIAL. Par le biais de son réseau indépendant, CORIAL distribue ses produits en Asie (Chine, Taiwan, Corée, Malaisie), en Russie et en Europe. 

  • Bernin, FRANCE (May 3rd, 2016) – CORIAL, a France-based provider of plasma etching and deposition equipment for R&D, semiconductor compounds, MEMS and LED industries, announced launching COSMA Pulse - a new software enabling pulsed or time-multiplexed processing on conventional dry process tools.


    The French company has said it has found a way to add new capabilities (pulse of process parameters) to conventional dry etching and PECVD systems to realize DRIE-Bosch processing, Atomic layer etching (ALE) and/or Atomic layer deposition (ALD).


    Developed with the R&D market in mind, COSMA Pulse can control and pulse simultaneously and independently from each other all process parameters, including gas flow rate, working pressure, RF power, LF power, or virtual process parameters.


    “We are proud to announce the first successful demonstration of COSMA Pulse on a 200 mm ICP-RIE system”, said Jean-Pierre Roch, R&D Manager at CORIAL. For this demo, CORIAL has chosen the DRIE-Bosch – a classical process which alternates repeatedly etching and passivation steps to achieve deep anisotropic etching of silicon structures. DRIE-Bosch is the cornerstone of MEMS, advanced packaging and power devices manufacturing flows. According to Jean-Pierre Roch “COSMA Pulse, with adequate electronic controller, will deliver very fast process step switching from 10 ms for a single process step up to 1 min”.


    This software ensures that the wide range of dry etching & deposition techniques from continuous wave plasma to pulsed processing can be realized in conventional ICP-RIE and PECVD tools.


    COSMA Pulse expands CORIAL available market, gives customers alternative options for their etching processes”, said CORIAL Marketing Manager Elsa Bernard-Moulin. “This demonstration is just a taste of the capabilities of COSMA Pulse. Soon, we will be letting you see true Atomic Layer processing on our conventional ICP-RIE tool.”


    For more information, please contact Elsa Bernard-Moulin at e-bernard-moulin@corial.net

    About CORIAL
    CORIAL is a manufacturer of plasma etching and deposition equipment which contributes to innovation in wafer processing for the semiconductor industry. CORIAL addresses a range of end-market applications including MEMS, LED, Advanced Packaging, Failure Analysis, and Wireless Devices. The technologies offered by CORIAL include RIE, ICP, ICP-CVD, and PECVD. With unique features such as precise process control for damage free etch, stress free deposition, or in-situ plasma reactor cleaning for the highest industry uptimes, CORIAL is committed to deliver the highest repeatability with the lowest cost of ownership.
    CORIAL equipment is designed and manufactured in France. Sales and support are provided worldwide through a network of 11 local offices and agents.

  • Bernin, FRANCE (March 07th, 2016) – Plasma etch and deposition equipment maker CORIAL extends the capabilities of the Corial 200I ICP system with etching processes targeted specifically at deprocessing of devices down to 20 nm.


    In the Failure Analysis flow, dry etch is the reference technology for sample deprocessing before any physical investigation of the device, to reveal a defect and identify its root cause. Deprocessing is a challenging step as the device must retain electrical integrity and its surface must remain planar for further tests. “For more than ten years, CORIAL drives innovation in Failure Analysis for the semiconductor industry”, said Elsa Bernard-Moulin, Marketing Manager, CORIAL. “Our core competences include tight adjustment of etch profile, over etch prevention for full retention of electrical integrity, and development of chemistries delivering planar etching without residues.”


    CORIAL has developed a variety of processes to enable removal of polyimide, silicon nitride, silicon oxide, ILD, low & ultra-low K layers and metal (Al). As an example, we demonstrated the capability to expose many layers of metal with SiO2 etch rate as high as 0.2 μm/min while leaving no residue on the sample surface.


    CORIAL leverages a concept of universal shuttle, enabling deprocessing of dies, packaged dies and wafers up to 200 mm, with only one etch equipment and no need for changing pieces of the reactor chamber to switch between sample types. The Corial 200I is built upon a production-proven technology with an inductively coupled plasma (ICP) source capable for low plasma potential and tight control of very low bias voltage, giving rise to minimum damage of metal lines. This etch system is fully automated, delivering stable processes with simple operation and minimum maintenance.


    For more information, please contact Elsa Bernard-Moulin at e-bernard-moulin@corial.net 

    About CORIAL
    CORIAL is a manufacturer of plasma etch and deposition equipment which contributes to innovation in wafer processing for the semiconductor industry. CORIAL addresses a range of end-market applications including MEMS, LED, Advanced Packaging, Failure Analysis, and Wireless Devices. The technologies offered by CORIAL include RIE, ICP, ICP-CVD, and PECVD. With unique features such as precise process control for damage free etch, stress free deposition, or in-situ plasma reactor cleaning for the highest industry uptimes, CORIAL is committed to deliver the highest repeatability with the lowest cost of ownership.
    CORIAL equipment are designed and manufactured in France.


 Products

  • Corial 210IL
    VERSATILE ICP-RIE ETCH EQUIPMENT FOR SILICON, SILICON COMPOUNDS, POLYMERS, METALS, III-V & II-VI COMPOUNDS ETCHING...

  • The Corial 210IL gives you complete flexibility
    Choose the Corial 210IL to etch Si, SiO2, Si3N4, SiC, Polymers, III-V or II-VI
    compounds by using/mixing fluorinated or chlorinated chemistries and benefit from
    flexibility with regard to substrate geometry and process requirements.

    Corial 210IL Key Features

    • ƒƒUnique reactor design with hot walls to avoid polymer condensation and to enable fluorinated and chlorinated processes at same time without cross-contamination between processes.
    • ƒƒWide process conditions from isotropic to anisotropic etch profiles.
    • ƒƒEasy switch of process modes (RIE, ICP+RIE, ICP).
    • ƒHigh power ICP source (up to 2 KW) with quartz liners for high etching and sputtering rates of hard materials such as glass, sapphire, SiC, LiNbO3, LiTaO3, or PZT in ICP mode (> 0.5 μm to 2 μm/min).
    • ƒƒHighly uniform etching for up to 200 mm wafer.
    • ƒƒEasy exchange between substrate shape and size thanks to shuttle loading.
    • ƒƒCOSMA Pulse process control software available as an option to enable pulsation of any process parameter for true atomic layer processing (DRIE-Bosch & Atomic Layer Etching) on the Corial 210IL.
    • ƒƒClean metal sputtering in RIE mode with optional & removable aluminum liner to be inserted in the reactor to collect the nonvolatile compounds produced during the etching process.
    • ƒƒTight control of etching conditions and prevention of photoresist damages based on the combination of cathode temperature regulation with helium backside cooling.
    • ƒƒMaximised uptime with pumping cycle <3 min and reactor cleaning cycle < 30 min.
  • Corial 210D
    ICP-CVD system for substrate sizes up to 8 inch LOW TEMPERATURE aSi-H, SiO2, Si3N4 and SiC HIGH QUALITY FILM DEPOSITION...

  • The Corial 210D opens up new possibilities
    Choose the Corial 210D to perform aSi-H, SiO2, Si3N4 or SiC high quality deposition at low
    temperatures to protect your organic or temperature sensitive substrates.

    Platform features:

    • ƒƒICP-CVD reactor technology with hot walls enabling minimum cross contamination between processes
    • ƒƒPreloaded carriers (“shuttles”) for rapid load and unload of system and elimination of cross contamination found in conventional reactor technologies
    • ƒƒSoft mechanical clamping and helium assisted heat exchange between cooled cathode, shuttle for precise wafer temperature management
    • ƒƒDeposition processes <100°C for temperture sensitive substrates
    • ƒƒIn situ plasma cleaning process eliminates memory effects, eliminates corrosion and removes need for manual reactor cleaning processes
    • Process database for deposition of wide range of materials

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