CyberOptics Showcases Advanced Airborne Particle Sensor and Auto Multi Sensor Technology at SEMICON Europa
Devices Speed Semiconductor Fab Processes and Improve Yields
Minneapolis, MN—Oct. 19, 2016— CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its advanced Airborne Particle Sensor (APS2) technology in both WaferSense® and ReticleSense® form factors at SEMICON Europa, Oct. 25-27, 2016 in Booth #1029. In addition, the company will feature its all-in-one Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and humidity in one convenient wireless real-time device.
CyberOptics’ Airborne Particle Sensors improve equipment set-up and long-term yields in semiconductor fabs by wireless monitoring airborne particles in real-time. The widely adopted WaferSense and ReticleSense Airborne Particle Sensors (APS2, APSR and APSRQ) can measure both small particles down to 0.14 microns in bins of 0.1 and 0.5 microns and can now measure larger particles, providing even greater flexibility. The new large particle detecting and measurement functionality extends the range, reporting particles in 2, 5, 10 and 30 micron bin sizes.
“Particle measurement in semiconductor environments is critical. Customers rely on our Airborne Particle Sensors to detect and identify when and where the particles originate. We’re giving them the information that there has been a catastrophic event, whether it’s small or larger particles, in order to avoid any further processing of the wafer,” said Dr. Subodh Kulkarni, president and chief executive officer, CyberOptics. “Essentially, the latest enhancements to our proven family of wireless semiconductor measurement devices help our fab and OEM customers deliver on three compelling bottom lines – saving time, saving expense and improving yields.”
CyberOptics’ WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool. The AMSR can capture multiple measurements in all locations of the reticle environment – providing yet another way to increase yield and reduce downtime in semiconductor environments. Controlling inclination, RH and vibration are all important factors in increasing yield and reducing downtime.
About the WaferSense and ReticleSense Line The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are
available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.
For more information about the entire line of CyberOptics solutions please visit www.cyberoptics.com.
For additional information, contact:
Lisa Grau, GrauPR, 760-207-9090, email@example.com
Carla Furanna, CyberOptics, 952-820-5837, firstname.lastname@example.org