CyberOptics Corporation

5900 Golden Hills Dr
Minneapolis,  MN  55416-1040

United States
http://www.cyberoptics.com
  • Booth: 1029


We look forward to meeting you in CyberOptics Booth #1029.

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity.

For semiconductor Fabs and Equipment OEMs, CyberOptics offers the world's most efficient and effective wireless measurement devices for various applications. The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.


 Press Releases

  • CyberOptics Showcases Advanced Airborne Particle Sensor and Auto Multi Sensor Technology at SEMICON Europa 

    Devices Speed Semiconductor Fab Processes and Improve Yields

    Minneapolis, MN—Oct. 19, 2016— CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its advanced Airborne Particle Sensor (APS2) technology in both WaferSense® and ReticleSense® form factors at SEMICON Europa, Oct. 25-27, 2016 in Booth #1029. In addition, the company will feature its all-in-one Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and humidity in one convenient wireless real-time device. 
    CyberOptics’ Airborne Particle Sensors improve equipment set-up and long-term yields in semiconductor fabs by wireless monitoring airborne particles in real-time. The widely adopted WaferSense and ReticleSense Airborne Particle Sensors (APS2, APSR and APSRQ) can measure both small particles down to 0.14 microns in bins of 0.1 and 0.5 microns and can now measure larger particles, providing even greater flexibility. The new large particle detecting and measurement functionality extends the range, reporting particles in 2, 5, 10 and 30 micron bin sizes. 
     “Particle measurement in semiconductor environments is critical. Customers rely on our Airborne Particle Sensors to detect and identify when and where the particles originate. We’re giving them the information that there has been a catastrophic event, whether it’s small or larger particles, in order to avoid any further processing of the wafer,” said Dr. Subodh Kulkarni, president and chief executive officer, CyberOptics. “Essentially, the latest enhancements to our proven family of wireless semiconductor measurement devices help our fab and OEM customers deliver on three compelling bottom lines – saving time, saving expense and improving yields.” 
    CyberOptics’ WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device.  The thin and light form factor enables the AMS to travel through virtually any tool. The AMSR can capture multiple measurements in all locations of the reticle environment – providing yet another way to increase yield and reduce downtime in semiconductor environments. Controlling inclination, RH and vibration are all important factors in increasing yield and reducing downtime. 
    About the WaferSense and ReticleSense Line The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are
    available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.  
    For more information about the entire line of CyberOptics solutions please visit www.cyberoptics.com. 

    For additional information, contact:
     
    Lisa Grau, GrauPR, 760-207-9090, lisa@graupr.com

    Carla Furanna, CyberOptics, 952-820-5837, cfuranna@cyberoptics.com

 Products

  • WaferSense & ReticleSense Airborne Particle Sensor
    Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um and larger particles within semiconductor process equipment and automated material handling systems. ...

  • Improve equipment set-up and long-term yields by wirelessly monitoring airborne particles in real-time.

    Thinner. Lighter. Precision Accuracy.

    Speed equipment qualification with wireless measurements.

    Collect and display particle data wirelessly using the APS2 and ParticleView™ software for real-time equipment diagnostics. Compare past and present as well as one tool to another with ParticleReview™. Save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs in real time.

    Shorten equipment maintenance cycles with wafer-like form factor.

    Detect particles in real-time without opening the tool, so you don’t need to expose process areas to the environment. Thinner and lighter APS2 goes where wafers go to find the place where particles contaminate wafers. Once the location of particles is identified, tools may be selectively cleaned. Open only the dirty portion, keep the clean areas clean.

    Lower equipment expenses with objective and reproducible data.

    Raise your first-pass monitor wafer success, reduce your qualification expense and increase availability with APS2. Receive early warning for impending equipment failures and optimize your preventative maintenance plans. Establish a baseline from a known clean tool, then cycle APS2 through a candidate tool before committing monitor wafers.
     
     
  • WaferSense & ReticleSense Auto Multi Sensor
    Speed equipment qualification with wireless measurements. Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor. Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data. ...

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    Speed vibration, leveling and humidity measurements with all-in-one measurement device. Improve yields.

    Speed equipment qualification with wireless measurements.

    Collect and display acceleration, vibration, leveling and humidity data. Monitor humidity in wafer environments. Use the Auto Multi Sensor with MultiView™ and MultiReview™ software for real-time equipment diagnostics.  See the effects of adjustments in real-time, speeding equipment alignment and set-up.

    Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.

    Thinner 3.5mm form factor provides access to more chambers. Operates at higher temperatures. Keep the process areas unexposed to the fab environment with vacuum compatible AMS.

    Lower equipment maintenance expenses and enhance process uniformity with objectiveand reproducible data.

    Take the human element out of adjusting your equipment with objective measurements for multiple applications in one. Make the right adjustments time after time. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.

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