The modular approach allows single chamber manual tool to up to eight chambers fully automated platform with solvent or acid processing chambers. Within the same tool carriers for manual cassette loading and change over to guardian carriers for full automation is possible. By changing the carrier different substrate sizes can be processed.
GALAXY E-Less Plating
An additional feature is the adding on of immersion tanks to allow the electro-less deposition of metals. The GALAXY-EL features pre-treatment, rinse-dry batch chambers as well as the tanks necessary to deposit metals very thin and very homogeneously, while offering superior bath life, minimal drag out and excellent uniformity.
GALAXY CUSTOMER ADDED VALUES
- Identical chambers for manual and fully automated tools in the modular platform
- Outstanding automation reliability and speed
- Possibility of processing more than one substrate size per chamber with change of carrier
- Electroless plating optional
- Upgrade- and future-proof
- Established high-throughput processing chambers
GALAXY HIGHLIGHTS
- Processing of 3” to 300 mm substrates
- Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
- Industry 4.0 ready – control and monitor all process parameters similar to a single wafer tool
- Etch uniformity 3% or better
- Online dosing system
- Online chemical monitoring
- Online gas detection for safety
- End-point detection system for etch process
- Ready to start prototype application as well as mass production processes