Yaskawa Europe Technology

Yaskawa has the capability to build a fully configured solution by using the most suitable automation components to meet customer specifications for cleanliness, throughput and accuracy.

We offer cutting edge technology for different size and capacity of Factory interface (EFEM’s or Mini-environment), starting with single loading station, through 2 wide, 3 wide, 4 wide enclosures and up to full cluster tools for several applications on the same platforms.

Yaskawa’s EFEM’s advantages set a new standard in the Semiconductor world:

• Customized Design

• Customized Configuration

• Short Delivery Time

• High Reliability

• High Throughput

• Global Support

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As part of the semiconductors manufacturing process, in some cases, there is a need to flip the semiconductor substrates.

Yaskawa offers an optimal solution of an external flipping unit with high performance and flexibility. 

Technical features:

Wafer & Substrate Size – 200 mm／300mm／200mm Ring／300mm Ring *1 (all or any of these sizes)

Wafer Material – Silicon, Glass

Wafer Detection – Optical sensor

Wafer Alignment Acknowledge – Less than 3 sec

Rotation Range – 0°-180° (no intermediate stop)

Clean Class – ISO Class 2

Wafer Holding Method – edge or vacuum grip

Detection of Rotation Position – Magnetic sensor

CDA Requirement – 0.5 MPa

Power Supply – VDC24

Approx. mass – 17kg