Welcome to the future of wafer dicing. #LiterallyCuttingEdge
LIDROTEC - the finest cuts on every wafer, "literally cutting edge".
Here at LIDROTEC, we stand for quality, innovation and precision. We build laser dicing machines to cut microchips for the semiconductor industry. Our technology reduces the damage rate in the cutting process to virtually 0% (current waste rate is up to 10%). Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser. Semiconductor manufacturers that use our cutting-edge technology will save costs and increase both productivity and their sales potential.