English - 英語
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku university.
As an exclusive techinical representative of GINTI "Global Integration Initiative" facility, we provide 3D/2.5D stacking IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production. Also, as an unique biomedical device developer, we develop and provide brain microprobes, based on our 3D IC, TSV and micro-bump technology, for Neuroscience field.
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