Among others, ISRA focuses their technical competence on the detection of internal cracks in manifold wafer materials. Using high-speed line camera and illumination layouts, our customers can benefit from superior defect recognition technology.
In combination with SEMI-compliant proprietary software packages, ISRA has proven to deliver a significant decrease of over rejected chips and dies. Inspection solutions can be combined individually. Options range from stand-alone measuring devices through to SEMI-compliant “BOLTS” architectures, enabling a flexible integration also in existing wafer handling setups.
This multiview technology provides high-speed throughput of several hundred wafer starts per day, representing a substantial cost saving potential for our customer processes.