Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.
Packaging wafers by Plan Optik are used to pack and thus to seal hermetically optical or chemical sensors, pressure sensors and acceleration sensors. Typical industrial applications lie in the fields of consumer electronics (CMOS imaging, micro-mirrors), automotive technology (pressure sensors, e.g. tires, engine monitoring), aerospace (3D acceleration sensors), chemistry (micro-reaction technology), pharmaceuticals (lab-on-chip) and in the general manufacture of semiconductors.