Besi (BE Semiconductor Industries N.V.)

静岡市駿河区中原,  静岡 
Japan
http://www.besi.com
  • 小間番号1612


Besi社は、世界トップクラスのシェアを誇る半導体後工程生産装置の製造メーカーです。


 出展製品

  • 2200EVO Plus
    2200EVOPlusはMultiModuleアタッチのため、全ての技術の粋を結集したプラットホームを装備しています。より高精度のボンディング機能と低いコストオブオーナーシップが特徴です。...

  • Performance

    • X/Y placement accuracy: ± 7 µm @ 3s
    • Theta placement accuracy: ± 0.15° @ 3s
       

    UPH

    • Die attach: up to 7,000 UPH/module
    • Flip Chip with dipping up to 2,500 UPH/module
    • Flip Chip without dipping up to 3,200 UPH/module
       

    Bond Heads

    • Standard bond head 0° - 360° rotation
    • Heated bond head (optional)
       

    Footprint

    • LxDxH: 1,160 mm x 1,225 mm x 1,800 mm
       

    Statistics

    • Uptime > 98 %
    • Yield > 99.95 %
       

    Wafer

    • Die size Die Attach: 0.17 mm - 50 mm
    • Die size Flip Chip: 0.5 mm - 50 mm
    • Die thickness: 0.05 mm - 7 mm
    • Wafer size: 2" - 12" (50 mm - 300 mm)
    • Frame size: 5" - 15" (125 mm - 375 mm)
       

    Chip Trays

    • Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
    • JEDEC tray on request
       

    Substrates and Carriers

    • FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
    • Gel-Pak®, JEDEC tray, odd-shape substrates
    • Substrate working range: 13” x 8”(325 mm x 200 mm)
       

    Options

    • Hardware: Open platform architecture for full customization
    • Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition, and more.

    Integrated Dispenser

    • Pressure/time (Musashi®), Auger, Jetter types available
    • Epoxy stamping option
    • Filled and unfilled epoxy, wide viscosity range
    • Small footprint, low cost-of-ownership
       

    Vision Alignment

    • New high-speed image processing unit
    • Full alignment & bad mark search
    • Pre-defined fiducial geometry & customized teaching
       

    Automatic Wafer and Tool Changer

    • Fully automatic cycle for multi-chip production
    • Up to 7 pick & place tools (optionally 14), 5 eject tools
    • Stamping tools and calibration tools possible
       

    Pick & Place Head

    • Die attach, flip chip and multi-chip in one machine
    • Die pick from: wafer, waffle pack, Gel-Pak®, feeder
    • Die place to: substrate, boat, carrier, PCB, leadframe, wafer
    • Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
  • 8800Quantum Sigma
    8800QuantumSigmaは、より高い精度と高い収 率により、シングルパスの生産を可能にする、マルチチップフリップチップ・プラットフォームです。加えて、加熱されたボンドヘッドとワークホ ルダー、超音波や熱圧着だけでなく、熱圧縮オプション、チップ・ツー・ウェハ接合のためのウェーハチャックの様な、高度な相互接続オプションを提供します。...

  • X/Y placement accuracy ± 5 µm @ 3 sigma
    Bond force 200 g - 5,000 g (less wit Low Force Kit)
    Die size 0.4 mm – 30 mm
    Die thickness 0.02 mm – 7 mm
    Wafer size 4" – 12" (on 8" or 12" wafer frames)
    Substrate types FR4, ceramic, BGA, strip, flex, boat, leadframe
    Working range 13" x 12"
    Flux film thickness Various cavity plates available
    Size 1,600 mm x 1,200 mm x 1,450 mm (W x D x H)
    Weight 2,000 kg

    Enhanced Accuracy, Higher Speed – Unbeatable Cost-of-Ownership for Flip Chip

    • Exceptional accuracy of ± 5 µm @ 3 Sigma at highest speed
    • Increased, higher productivity, highest yield
    • Operator-independent quality by fully automatic machine calibration 
       

    High Flexibility – No Compromise for any Production Process

    • Capability to handle any flip chip size
    • No restriction on substrate type (leadframes, strips, panels, wafers up to 8")
    • Ready for ultra thin die handling
       

    High Reliability – Consistent Quality, Minimal Risk

    • Field-proven, reliable machine concept and production process
    • Matching the requirements of IDMs and subcons (90% market share)
    • Unbeatable benchmark for flip chip assembly equipment
       
  • Fico Compact Line
    Fico Compact Line™(FCL)は、製造プロセスにおいて今日の最先端の技術を搭載しております。FCLのコスト/性能比は、業界で唯一無比のパフォーマンスをお約束します。FCLは、リード付及びリード無しパッケージの双方に対応します。Ficoompact Lineへの投資は消耗部品だけでもシステムあたり年間最高10 万ドルの節約になることがあります。...

  • Machine Dimensions

    Width* 1,350 mm
    Depth* 1,026 mm
    Height* 1,600 mm
    Weight* Approx. 1,300 kg

    * Final data depends on user specific data and machine configuration

    Leadframe Dimensions

    Width: 18 - 101.6 mm
    Length: 150 - 280 mm
    or endless strip (reel to reel)

    Supply Requirements

    Voltage 208-230-400-440-460-480VAC - 3~
    Frequency 50 / 60 Hz
    Power rating 1.5 kVA
    Average air consumption 50 l/min

    Properties

    Speed Up to 250 strokes per minute
    Noise level <75 dB(A)

    • Modular design
    • High flexibility
    • Quick conversion
    • Very high output
    • Revolutionary (patented) wheel transport
    • Integrateable laser marker
    • Full range of standard offloaders
    • High quality tools
       

    Available Modules

    • Slotted cassette handler
    • Reel handler
    • Stack magazine handler
    • Compact Line Presses
    • Laser marker
    • Separation unit
    • Front bulk offloader
    • Tray handler Jedec
    • Tube master
    • Multi channel tube handler
  • EPL
    Mecoはリードフレームはんだメッキにおいて業界標準としての地位を確立しています。システムは完全にユーザーの特定ニーズに合わせ てカスタマイズされ、低消費電力と最小限の化学物質の使用量により環境に優しいソリューションをご提供します。 Mecoエレクトロデフラッシュ、エレクトロメッキラインは、将来リードフレーム製品のあらゆる種類を扱うことが可能な様に設計してあります。110X315mmまでのリードフレームサイズは容易にMeco EDF/ EPL 上で扱うことができます。...

  • The Meco EDF/EPL System Provides Such a Solution!

    The molded cut strips are placed in stack or slotted magazines and fully automatically loaded onto an endless carrier belt. A specially design clip device holds the strips in mechanically and electrical contact with the metal carrier belt as shown. The continuously moving carrier belt, upto 8m/min, transports the strips through pre-treatment, rinse, plating, post treatment and drying stations to the fully automatic, synchronized unload position where the strips are discharged into the magazines. In the return passage the carrier belt can be stripped to remove possible flash deposits.

    The continuous processing of the strips by the carrier belt through the machine has two major benefits. One, it offers excellent distribution, because as any individual strip goes through the plating cell, it sees the same set of plating conditions as the previous and the following strip see. Therefore, distribution from product to product is excellent with little or no variation seen in distribution from one product type to another type. In addition, the products are very close to each other loaded onto the carrier belt. The gap is only 2 or 3 mm between each product, therefore no burning is seen, similar to normal reel-to-reel processing.

    In addition, bottom shielding in the plating bath is controlled by the computer and is menu-driven based on the product. The shielding reduces the plating on the lower areas of the product (dog bone effect) and is fully automatic, requiring no operator adjustment.

    High Product Flexibility and Fast Change-Over Time (<5 min)

    The carrier belt in combination with the universal loading and unloading systems makes this plating line very flexible for running a large variety of product types like powerframes, discetes, QFN and matrix-frames. The machine can handle all frame sizes with a minimum length of 150 mm to a maximum of 269 mm and a minimum width of 20 mm to a maximum width of 90 mm. With just a few product related parts, fast change-over times (up to 5 min) can be achieved by just one operator.

    Integrated Electro Deflash System (Meco EDF)

    After molding, some of the mold residue (resinbleed) might get stuck on the leadframe. Especially on the functional areas, such as heat-sinks and between leads, no flash is allowed otherwise they do not get solder plated. To remove this thin flash before solder plating we can offer our Meco EDF system which can operate standalone or can be integrated into the Meco EPL solder plating system. After the frames are loaded onto the carrier belt, they are soaked in a 'deflash'-solution in combination with cathodic current. These chemicals are slightly softening the mold-flash/bleed and reducing the adhesion of the mold-flash/bleed. Furthermore, the applied current produces, hydrogen on the cathode (product). These hydrogen bubbles will initiate the mechanical loosening of the flash/bleed from the metal part of the molded products. After the electrochemical treatment the flash is removed by a high pressure waterjet.

    Computer Controlled

    The Electro Plating Control Software (EPCS) makes it easy to control a plating line. It is supplied with an easy to use operator-interface (based on the Windows operating system) giving you a clear view of the status of the plating line. All of the plating lines processes are represented schematically, colors indicating their state. The overal system state of the line is controlled via the state diagram. Switching on the machine and starting or stopping production is established by clicking the mouse. The control system ensures that all process parameters are within specification values before production is started.

    The most important process parameters are shown too, giving an instant overview of the production situation. All process parameters are easily accessible, all setpoints, warning and error brackets can be modified if that the user is authorized to do so. The complete set of process parameters can be stored in a recipe. Recipes can be reviewed, modified and copied on-line without affecting the recipe currently in use for production. An unlimited number of recipes can be created, enabling fast and easy change-over when switching to products with different specifications.

    Each user of the control software has his own authorization level. This security level indicates which tasks he is allowed to perform. Before working with the system, every user must identify himself by logging in. After having logged in, the tasks the user is allowed to perform are limited by his authorization level. Tasks that need a higher authorization level are simply not accessible.

    Low Running Cost

    This high quality, generic plating line with its universal loading/unloading system and integrated deflash system ensures you a high quality production with a low water usage resulting in high production yields and low running costs.


 追加情報

初出展/New Exhibitor
Yes
新製品/New Products
No
製品展示/Displaying Equipment
No
デモンストレーション/ Product Demonstrations
No
産業・技術分野/ Industries/Technologies
半導体/Semiconductor