Nidec Machine Tools Co., Ltd. (formerly Mitsubishi Heavy Industries Machine Tool Co., Ltd.) will exhibit room temperature Wafer Bonding Machine BOND MEISTER.
This technology firmly bond a wide range of materials such as silicon-based materials, compound semiconductors, optical materials, and metals at room temperature. It can bond at full room temperature, no heating or annealing required. The scope of application is rapidly expanding in WLP, SAW filter substrates, power device substrates, 3D stacking, etc.
At Semicon Japan NIDEC MACHINE TOOL will introduce bonding samples of various materials and examples applied to power devices, MRAM, and solar cells.