Speedfam Co., Ltd.

Silicon wafer edge is consisted of upper bevel, lower bevel, and
apex.Speedfam edge polishing machine type X contributes to high productivity
per unit area and labor-saving in plant by high-speed polishing 3 parts
individually.
Speedfam has a wide variety of edge polishing machine appropriate to wafer
size:i.e. EP150/200 for  6-8 inch and EP-200-XW for  8 inch & EP-300-XX for
 12 inch which are high rate/high volume production spec.They also perform
the process of notch/orientation flat part.
We recommend Brush type Edge polishing machine for low cost /high speed
batch processing.This machine is a high cost performance model which can
stack up to 100 pcs of work piece such as Oxide wafer, sapphire, etc,
We also provide wafer periphery chamfering machine (Edge grinding 
machine ) which grinds circumference of wafer (silicon, LT/LN, sapphire, SiC,
GaAs, GaN,etc) cut off from ingot by abrasive wheel with high accuracy.
As well as usage in preprocess of edge polishing, this machine offers grinding
of hard/weak work piece due to its advantage in bearing accuracy.

Double side laping/polishing machine offer a wide variety of additional specification to
Speedfam proprietary spec by customer request. Applicable for wide range of target from
very small, ultrathin work piece to large size glass substrate.Highly contribute to stable production and labor-saving in plant by functions such as end
point detecting for work piece, automating transport.

Speedfam original carrier covers a wide variety of carrier material/size.
Especially, Hybrid carrier is effective in high accurate double side processing.
This carrier enables reduction of chipping and scratch by contact between
work edge and carrier edge and accurate control of metal matrix thickness.
We also offer special coating carrier (DLC, etc) for metal contamination measures.

Speedfam also offers a wide variety of polishing pad and slurry, which
influence processing accuracy of work piece. (polishing pad: urethane,
unwoven fabric, suede,  slurry: silica, cerium, diamond, boron carbide,etc…)
Besides the above, we also provide the following measurement machine which
contribute to labor-saving in plant and productivity improvement.

Optical edge measurement equipment [Edge Profiler]

This is measurement equipment which enables measuring work (wafer, etc) edge, angle, and notch
part after edge polishing at once.This machine covers 2"-12" size wafer and enables measurement result and image storage as a optional function, system integration between speedfam chamfering machine and edge profiler by wireless online is available, which reflects measurement results instantly.
Each edge profiler enables data transmission to up to 20 chamfering
machine.We can provide correction table which applied to other company’s
product.This machine also enables measurement of TSV wafer.

Pad flatness measurement machine [Flat Chaser] :

This machine offers method for quantitative analysis to analysis of relationship between Time-dependent
change of pad shape and change of wafer shape which previously depended
on operator’s skill. Which also allows for measurement of lapping plate shape
within ±5 μaccuracy.