SCREEN Semiconductor Solutions Co., Ltd.

-Can be equipped with up to 16 chambers, an industry first* for a scrubber type system. A new dual
transport system greatly boosts production volume per unit area

-Footprint is 27% smaller than two 8-chamber SS-3200 spin scrubbers, saving space and delivering
exceptional cost performance

-Redesigned control system enhances smart factory manufacturing capabilities and enables
expandability for IoT and intersystem connectivity

* Based on SCREEN in-house research (as of December 2020)

-Simultaneously performs chemical and brush cleaning for highly effective removal of particles from the back side of wafers

-Controlled etching using ultra-precise nozzle motion and a chemical dispensing control function deliver highly uniform etching while suppressing wafer warping

-Proprietary chuck system prevents etching residue on wafer edges and chemical wraparound on device surfaces

・High throughput of 650 WPH

・Simple configuration featuring 7 independent modules

・The HiLPD low-pressure drying system greatly reduces watermarks and high-concentration IPA vapor prevents pattern collapse

1. Approximately Double the Throughput of the Previous Model

2. Capable of Detecting and Analyzing Microscopic Defects of 1μm or less

3. Easily Create Recipes while Checking the Actual Wafer Image.

1. Throughput of up to 1,200 wph

2. Footprint reduced by 30%

3. Reduction of environmental load (Exhaust/Nitrogen/Chemical)

4. Stable operation using Big Data and malfunction prevention through camera surveillance