日本語
We are welcome you in our booth.
YGK corporation is manufacturing the non-patterned wafer surface inspection system YPI-series which handle mainly a process monitor in semiconductor Fab. The YPI-series can be applied to wide range categories of semiconductor process such as the front-end process, back-end process, and compound wafer process. We are welcome you with various products in this exhibition.
YPI-MX-TF
The YPI-MX-TF can be inspected a wafer and a dicing wafer that are mounted on the tape frame. The product is matched to back-end process, and can be checked contamination for after dicing and after removing a protection tape on a wafer surface.
YPI-MX-DC
The YPI-MX-DC has been developed for inspection to a silicon carbide wafer. The product can be selected configurations to match a laboratory and mass-production process, and has a detection capability 0.1μm on the silicon carbide.
YPI-MX
The YPI-MX is matched to wide range categories. The product can be handled both opaque and transparent wafers, and can be selected a various kind of transfer system. The product can be available to add 60nm sensitivity on bare silicon as option.
YPI-MN
The YPI-MN is matched to a laboratory. Everyone can be easy use. The product is not required huge placing space in a clean room.
YPI-MXは透明及び不透明ウエハ表面の異物検査が可能なウエハ表面検査装置です。搬送はマニュアル搬送・自動搬送に対応でき、自動搬送もSMIFやFOUPなど量産プロセス対応も可能な装置です。検出感度はオプションで60nm（ベアシリコン）を搭載する事ができる装置となっています。