Ayumi Industry Co., Ltd.

Kagumachi, Bessho, Himeji,  Hyogo 
Japan
http://www.ayumi-ind.co.jp
  • Booth: 1814


We respond need with vacuum technology, reduction technology

Focusing on vacuum technology, we will exhibit about vacuum equipment that contributes to the manufacture of semiconductors and electronic components. We respond to a wide range of needs such as fluxless reflow equipment that can perform high-quality reduction treatment and soldering of solder and metals without flux, high-precision alignment between wafers, wafer bonding that realizes WLP, room temperature bonding equipment, vacuum annealing, glove box, vacuum sealing equipment. 

 Products

  • Surface activation bonding equipment
    This equipment activates the surface of the wafer and bonds it at room temperature. ...

    • Centering on the surface activation/bonding unit, the weight unit, heating unit, alignment unit, and analysis unit are efficiently arranged, and a unit for transporting in a vacuum can be provided. The activation source can be selected from ion beam, fast atom beam, and sequential plasma. From prototypes to mass-produced machines, we have a wide lineup to meet the needs of our customers.
  • Chip-on-wafer direct transfer bonding equipment
    This equipment uses CoW DTB technology to directly transfer and bond heterogeneous function chips of about 1 mm on a Si wafer....

    • Contamination of the bonding surface becomes a problem when bonding directly after activating the surfaces of the Si wafer and chip by plasma processing. CoW DTB equipment enables bonding without direct contact with the activated bonding surface, so high yields can be achieved.
  • Anodic bonding equipment
    Glass such as Pyrex is bonded to Si. It is one of the most widely used bonding methods for MEMS bonding. Recently, low-temperature bonding has also been realized....

    • Supports wafers up to 8 inches. Supports accuracy of ±1㎛ or more by manual to full auto alignment (some models are built-in). We have a full line-up that supports everything from development to mass production,and we are proposing equipment according to production capacity.

  • Fluxless reflow equipment
    This equipment removes the oxide film using formic acid and performs heating reflow....

    • It can be used for many applications such as wafer soldering, semiconductor chip soldering, and large area soldering for power equipment. We support a wide range of applications from R&D to mass production.

  • Vacuum sealing equipment
    Equipment for hermetic sealing packaging of electronic devices....

    • The inside of the package can be kept in a gas or vacuum atmosphere, and the device characteristics can be stabilized.

    Solder, eutectic, glass, adhesive, etc. can be used as sealing materials. In addition, it is possible to melt the glass to create an airtight seal or melt the glass beads into the lead wire. In particular, it is characterized by the ability to eliminate thermal strain during packaging of devices that are becoming smaller and thinner, and the ability to maintain a high vacuum inside the package.

    Also, due to the excellent moldability of glass, bead fusion of lead wires with high dimensional accuracy is possible.

    Continuous hermetic sealing without exposing the packaging to the atmosphere after baking.

Categories

200 Equipment, Assembly
  • Wafer Level Bonders
  • Solder Reflow; Soldering & Brazing Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vacuum drying & out gassing Systems
    • 400 Components, Parts & Accessories
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants; p
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