日本語
Laser bonding and fluxless bonding technology are exhibited.
● Laser Bonding of 3600mm2 Large Die
Introducing LATCB (Laser-Assisted Thermo-Compression Bonding), a new technology that uses a laser to heat and cool a large die at high speed while maintaining the functions of TCB. 60 x 60 mm large die can be supported.
● Fluxless Bonding
Fluxless solder bonding is possible using plasma and forming gas. Clean bonding without corrosive residues is possible. This simple system does not require a chamber and can be used for large dies (60 x 60 mm).