AEMtec GmbH is a German high-density, high-precision assemble ODM. Semiconductor chips and electronic components are mounted directly on the substrate.
AEMtec is a high-precision semiconductor, sensor, electronic component assemble ODM, spun out from German semiconductor manufacturer Infineon in 2000. AEMtec owns the equipment to process purchased or provided semiconductor wafers (bumps, solder balls, copper pillars, dicing, etc. on the electrode part of each chip), and offers chip-on-board, various flip chips, silicon via, etc. AEMtec provides the world's highest level of high-density assemble that realizes customer specifications by directly mounting semiconductor elements on various substrates using advanced technology. AEMtec develops and manufactures extremely small sensor modules for sensor manufacturers. We also provide advanced assemble products such as medical board units to electronic medical device manufacturers. (As an example, we stack a photodiode chip and an ASIC chip and process silicon via to provide an ultra-compact and lightweight scanner module.) At this exhibition, various sensor chip modules mounted according to customer specifications, various substrates and units with high-density and high-precision mounting of optical components and IC chips are exhibited. AEMtec has partnered with Japanese assemble manufacturer Connectec Japan Co., Ltd., and has established a system to quickly provide development and prototyping in Japan.