The AEGIS system with NEXTIN’s innovative two-dimensional imaging technology is a cost effective, high-performance defect inspection equipment. The high-resolution CMOS sensor, which allows high-speed and high-precision inspection, provides high throughput, lowers noise, and results in better signal-to-noise ratio (SNR) by applying two-dimensional imaging technology. Directional illumination filters out pattern signal and detects only interested pattern defects with high signal on the filtered images. Bright field and dark field inspection capability in one equipment can detect not only defects that are well detected by dark field inspection but also defects that are well detected by bright field. With this combo feature, AEGIS Wafer Inspection System can be used for all patterning (photo & etch) processes and film-related processes like CVD and CMP processes in FEOL (Front-End Of Line) and BEOL (Back-End Of Line).
The IRIS system with NEXTIN’s innovative three-dimensional imaging technology is the sole solution for 3-dimensional wafer fabrication process such as high aspect ratio process of 3D flash memory or TSV process of high bandwidth memory (HBM).