KOBUS

Montbonnot-Saint-Martin, 
France
http://www.altatech-sc.com
  • Booth: 2272

Altatech offers a unique portfolio of equipments for both mature and advanced materials deposition as well as holistic defect inspection. Altatech develops highly efficient cost effective INSPECTION and CVD/ALD technologies used for pilot and manufacturing of semiconductor, R&D, LEDs, MEMS and photovoltaic devices.

Since its creation, Altatech has continued to grow by cultivating innovation and creating solutions tailored to our customer’s specific needs.


 Products

  • COMET® SERIES
    The Altatech COMET® series of advanced metrology and inspection solutions ensure die conformality while substrate is mounted on film frame ...

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    The Altatech COMET® series of advanced metrology and inspection solutions ensure die conformality while substrate is mounted on film frame, including surface inspection as well as 2D- 3D metrology (bump, cavity, complex structure …). Proprietary COMET® sub-modules are designed to detect, count, and bin defects on whole wafers and singulated wafers mounted on film frame.

  • ECLIPSE® SERIES
    Edge, Front-side and Back-side Inspection on un-patterned and patterned surfaces ...

  • The Altatech ECLIPSE® series offers advanced inspection solutions to ensure wafer surface and edge quality by detecting, counting, and binning defects during the wafer manufacturing process. Proprietary ECLIPSE® sub-modules are designed to detect and classify defects of interest on the front surface, back surface and wafers edge.

  • ECLIPSE TS® SERIES
    Edge, Front-side and Back-side Inspection on very thin wafers ...

  • The Altatech ECLIPSE TS® series offers advanced inspection solutions to ensure wafer surface and edge quality by detecting, counting, and binning defects during the wafer manufacturing process. Proprietary ECLIPSE TS® sub-modules are designed to detect and classify defects of interest on the front-side, back-side and edge of very thin patterned or unpatterned wafers.
  • ORION® SERIES
    Front-side, Back-side and edge Inspection on patterned surfaces ...

  • The Altatech ORION® series of advanced metrology and inspection solutions ensure the full range of inspection and metrology of front-end manufacturing process flows, including incoming wafer qualification, process development, and line monitoring. Proprietary ORION® sub-modules are designed to detect, count, and bin defects on patterned and un-patterned wafers, including edge inspection and bump metrology.

  • Altatech’s Fast Atomic Sequential Technique
    Altatech patented FAST© deposition technique combines unique performance of pulsed CVD with a dual channel showerhead, allowing customer to develop new process materials with high added value. ...

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    Features

    • Pulsed thermal CVD or RF-enhanced deposition

    • Reactants and precursors’ pulses customization for high quality layers deposition

    • Isotropic deposition for highly conformal layer

    • Low-frequency plasma available for tuning materials’ mechanical/electrical/optical properties

    • Wide spectrum of deposited materials through a wide range of vaporization – up to 200 °C and deposition temperatures – up to 650 °C

  • Altatech’s RUBY© for 3D-TSV deposition
    Altatech RUBY© performs FAST© depositions, an Altatech patented technology, dedicated to TiN barrier and Cu seed layer deposition during 3D-TSV manufacturing. ...

  • Features

    • 150-200 mm or 200-300 mm version

    • Full product offering surface pre-clean, TiN barrier and Cu seed layer deposition.

    • Developed for high-volume production with low cost of ownership and high throughput.

    • Low maintenance requirements and minimized footprint