TECHNIC KOREA

Seoul, 
Korea (South)
http://www.technic.com
  • Booth: 4534


Hello, This is Technic Korea.

Technic supplies some of the most advanced chemistry solutions for semiconductor packaging applications in the industry.  Technic’s semiconductor advanced packaging electrodeposition chemistries, marketed under the name Elevate, are well respected for innovation and high quality and are used in many applications including RDL, pillars, microbumps and LED packaging.  Technic also supplies, photoresist strippers for liquid and dry film resist as well as metal etchants.

 

Technic Inc is a Rhode Island based, privately held corporation with over 900 employees worldwide.  For 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries.


 Products

  • Elevate Gold 7990
    Electrolytic non-cyanide gold process that produces pure, soft gold deposits....

  • Electrolytic non-cyanide gold process that produces pure, soft gold deposits. Offers several advantages over standard sulfite gold baths including neutral pH, no metallic grain refiners, longer bath life, exceptional throwing power and a very stableelectrolyte.

    FEATURES AND BENEFITS:
    1. High cathode efficiency.
    2. Low internal stress.
    3. Neutral pH for optimum compatibility with plating resist
    4. Deposit can be modified for different applications
    5. Cyanide free solution
    6. Compatible with standard industry plating tools


    DEPOSIT CHARACTERISTICS
    Deposit is semi-bright to bright
    Deposit purity: 99.99% gold (minimum)

  • TechniEtch TBR19
    TechniEtch TBR19 is in production for advanced RDL and Cu pillar on Ti & TiN, TiW barrier removal....

  • • For Ti and alloy etchant


    • Ready to use & POU, high uniformity WtW, WiW


    • Fluoride free aqueous solution


    • Better proccess control- upt o 80% overetching with minimum undercut features


    • Selective Titanium (Ti) and alloys (TiN, TiW) based barrier etchant


    • Compatible with most UBM, and copper pillar integration materials such as Cu, Al, Ni, Sn & alloys, Glass, organic substrate, etc.

  • TechniStrip Micro D2
    NMP replacement alternative to address resin lift off and dissolution. It offers high metal and material compatibility allowing to be used on all stacks and particularly on fragile III/V substrates for instance....

  • • A solvent mixture compatible with all substrates & metals
    – III/V and organic substrate
    • P tone resin dissolution
    • Great NMP alternative
    • Metal lift off
    – More efficient and quicker
    • 30-85°C, 30”- 25min
    • Direct water rinse
    • High loading/long bath life
    • Better wetting surface capability
    • Suitable for immersion systems, soak & spray, batch Spray


    When chemical reactivity meets metal compatibility

  • Real Time Analyzer (RTA)
    RTA is a fully automated, on-line, real-time, in-tank system for monitoring and controlling levels of chemical constituents. This unique and patented analytical technique is based on electrochemical technology and utilizes the AC and DC voltammetry....

  • Real Time Analyzer
    RTA is a fully automated, on-line, real-time, in-tank system for monitoring and controlling levels of chemical constituents. This unique and patented analytical technique is based on electrochemical technology and utilizes the AC and DC voltammetry.
    The Technic RTA is the only commercially available automatic instrument that utilizes a combination of modern electrochemical techniques (Cyclic Voltammetry including) with state-of-the-art statistical (chemometric) approach.


    Features and Benefits
    • On -line in-tank method
    • Automatically analyzes undiluted bath
    • No need for reagents or chemical operations (no waste generation)
    • Total analysis (all 6 components) typical time 15-25 minutes
    • Early faults detection capability
    • Small footprint
    • Virtually no maintenance
    • Low cost of ownership


    The Multi Task Electrochemical Probe (MTEP) has no moving parts and virtually eliminates the excessive probe maintenance required by competitive instruments.
    The patented design does not require a classical reference electrode and the automatic sequence creates reproducibly a clean working electrode for each measurement. This feature improves analytical consistency, reduces maintenance as well as eliminates down time and cost due to worn electrodes.

  • Real Time Analyzer - 3D
    Real Time Analyzer 3D utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness....

  • Real Time Analyzer - 3D
    Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The redesigned RTA3D enhancements allow the system for more customization of experimental conditions, software, and applications.


    Features and Benefits
    • State-of-the-art of electronic components
    • Innovative electrochemical techniques
    • Intuitive Graphical User Interface
    • Design based on field experience and customer input
    • Virtually consumable free
    • Automatic temperature correction capabilities
    • Open software architecture allowing advanced customization and integration

  • TechniStrip® P1331
    An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layerreworking. Ideal for use in back end applications like TSV, Cu pillar, bumping, etc. ......

  • Technistrip® P1331 offers complete resin dissolution of thick film photoresist such as THB151N, THB121N, AZ125XT, etc. In addition Technistrip® P1331 is fully compatible with Dryfilm resist such as WB2000 series.


    Technistrip® P1331 utilizes a novel cleaning formulation that has been proven to provide a loading capacity three times higher than a standard TMAH based blend. Additional advantages of the Technistrip® P1331 are its very high material compatibility and safety compared to standard TMAH based blends. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.


    FEATURES AND BENEFITS
    1. Very high stripping rate, >10μm/min
    2. Complete resin dissolution
    3. Enhanced resin loading capacity
    4. Low evaporation rate, < 3 cc/hour/dm2
    5. High metal compatibility, <2A/min @60°C
    6. Complete water miscibility
    7. Suitable for batch (spray and immersion) and single wafer systems
    8. Low odor compared to standard DMSO/TMAH resist strippers
    9. Safety: Free of NMP and Hydroxylamine

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