02-531-7800

 

JEOL Korea Ltd.

Seoul, 
Korea (South)
http://www.jeol.co.kr
  • Booth: C416


Welcome and thank you for your interest in JEOL KOREA Ltd.

JEOL KOREA Ltd. is professional company supplying many kinds of the highly advanced R&D and production instruments connected with IT(Information Technology), BT(Bio Technology) and NT(Nano Technology) business for the foremost korean customers in the industry, univ., and research institute. Based on our accumulated technology, we will make assurance to do our best for contributing to the development of next generation nano technology.


 Press Releases

  • UNIST signs MOU with JEOL to improve the thermal stability of Li-ion batteries and associated components.

    Earlier today, UNIST signed a Memorandum of Understanding (MOU) with JEOL Ltd., Japan’s leading manufacturer and supplier of a wide range of scientific and analytical instruments. This collaboration represents a significant commitment to work together to enhance the reliability and safety of lithium ion batteries (LIBs) and associated components.

    Through this partnership, the UNIST-JEOL TEM Center for Lithium Battery Analysis will be built in UNIST Secondary Cell Research Center. This is the first time JEOL to set up a joint analysis center on LIBs since the University of Tokyo.

    Established in 1949, JEOL Ltd. is a global supplier, researcher and developer of scientific instrumentation, industrial equipment, and medical devices used in the fields of optical communication, nanotechnology, life sciences, forensics and biotechnology. The firm operates nearly 17 overseas subsidiaries and has sales offices located in 30 countries.

    Exposing LIBs to extremely high or low temperatures, voltages or excessive currents results in accelerated battery degradation and in the worst case battery failure. To ensure a safe use of LIBs, the battery materials must be evaluated for thermal stability.

    In the memorandum of understanding, the two organizations promised to expand cooperation and exchange in battery safety research with a focus on thermal stability of LIBs. As part of their research, both organizations will look into the changes in LIB materials that may occur under abnormal operating conditions, such as heating, ignition and breaking. They will use the transmission electron microscopy (TEM) to study minute structures of LIB materials. Through this partnership, they hope to build an ideal battery material that remains stable over very long time scales during continued operation.

    TEM is a microscopy technique in which a beam of electrons is transmitted through an ultra-thin specimen, interacting with the specimen as it passes through it. The use of an electron beam having shorter wavelength makes it possible to observe nanometer-scale structures.

    What is shown above is the nation’s first TEM for secondary battery research, located at the UNIST-JEOL TEM Center for Lithium Battery Analysis. This is the latest equipment, established by JEOL Ltd. and is worth about five billion won. It was established as part of the ‘Infra Structure Project to Support Green Energy Material R&D’, supported by the Ministry of Trade, Industry and Energy and the Ulsan City.

    “Through this partnership, UNIST will take the lead in creating a secondary battery research ecosystem with Ulsan as the center,” says President Mooyoung Jung.

    http://news.unist.ac.kr/unist-brings-breakthrough-in-li-ion-battery-technology/

  • (20180109)
  • (20180109)
  • (20180109)

 Products

  • [GenISys] Pro-SEM
    ProSEM analyzes your SEM Image files, giving you fast, consistent feature measurements for your process calibration and monitoring tasks....

  • Nano-patterning requires accurate and reproducible metrology. Since automated CD-SEMs are expensive and not flexible, manual SEM tools are used at most nano-fabrication centers. ProSEM enables automated feature size (CD) measurements from manually taken SEM images.

    Meaningful process monitoring and process calibration tasks need many measurements from numerous SEM images. ProSEM Provides stable, consistent feature size measurements with an easy-to-use interface.  It removes the operator induced variation.

    Measurements reported include: feature size at top or bottom, line edge roughness, line width roughness and spectral analysis. Shape analysis, side wall angle, CD uniformity and other measurements will be added.

    1D and 2D image views show the edge finding results, visualizing the quality of the measurement.

    Image processing coupled with advanced edge finding algorithms enable measurements under difficult conditions.

    ProSEM will interface to the other GenISys products to support process analysis and calibration.

    Capabilities include

    ■ Advanced algorithms

    ■ Convenient data handling

    ■ Analysis of lines, trenches, gratings, circular and square features.

    ■ Interfaces to other GenISys tools

  • [JEOL] JBX-9500FS Electron Beam Lithography System
    JBX-9500FS is a 100kV EB system that provides world-top-level throughput and positional accuracy among Spot beam lithography systems....

  • JBX-9500FS is a 100kV EB system that provides world-top-level throughput and positional accuracy among Spot beam lithography systems. This EB system can accommodate up to 300mmΦ wafer and up to 6-inch mask, thus responding to R&D and production in various fields, such as nanoimprint, photonic device and communication device.

    In addition to the maximum scan speed of 100MHz, JBX-9500FS achieves overlay accuracy of ±11nm, field stitching accuracy of ±10nm and positional accuracy within field of ±9nm when the field size is 1000µm×1000µm. Thus, JBX-9500FS is a 100kV EB system that provides world-top-level throughput and positional accuracy among Spot beam lithography systems.

    Since JBX-9500FS employs Beam positioning DAC of 20bits and Scan DAC of 14bits, higher-resolution scan step of 0.25nm is obtained for writing data increment of 1nm, thus reproducing more precise writing data.

    Its high scan speed up to 100MHz enables JBX-9500FS to maintain short scan steps at large-current writing, thus enhancing throughput even when high-precision pattern writing is required.

    World-top-class positional accuracy is achieved by LBC (laser beam control) that provides the high-resolution, minimum beam positioning step of 0.15nm (λ/4096).

    Furthermore, a unique auto calibration function (automatic correction function) developed by JEOL achieves highly reliable, stable pattern writing for a long period of time. Timing of auto correction can be set for each field or each pattern. This function is very effective for a long period writing without an operator, for example at weekends or consecutive holidays.

    JBX-9500FS can accommodate up to 300mmΦ wafer and up to 6-inch mask, thus responding to R&D and production in various fields, such as nanoimprint, photonic device and communication device. Adding the material cassette transfer system (option) enables this EB system to load up to 10 cassettes.

    The use of Fine Pitch Control Program (field size fine modulation program) enables JBX-9500FS to fabricate a chirped-period grating such as a DFB laser.

  • [JEOL] JBX-8100FS Electron Beam Lithography System
    Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving. ...

  • Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.

     
       Small footprint

    The area required for the standard system is 4.9 m (W) x 3.7 m (D) x 2.6 m (H), much smaller than the conventional systems.

    Low power consumption

    Power needed for normal operation is approximately 3 kVA, reduced to 1/3 of the conventional systems.

    High throughput

    The system has two exposure modes, high resolution and high throughput modes, supporting different types of patterning from ultra fine processing to small to mid size production. It has minimized the idle time during exposure while increasing the maximum scanning speed by 1.25 to 2.5 times to 125 MHz (the world’s highest level) for high speed writing.

    Version

    The JBX-8100FS is available in 2 versions: G1 (entry model) and G2 (full option model). Optional accessories can be added to the G1 model as needed.

    New Functions

    An optional optical microscope is available to enable examination of patterns on the sample without exposing resist to light. A signal tower is provided as standard for visual monitoring of system operation.

    Laser positioning resolution

    Stage positions are measured and controlled in 0.6 nm steps as standard, and in 0.15 nm steps with an optional upgrade.

       System control

    Versatile Linux® operating system combined with a new graphic user interface provides ease in operation. The data preparation program supports both Linux® and Windows®.

    Notices:
    Windows is a registered trademark of Microsoft Corporation in the United States and other countries.
    Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

  • [JEOL] JIB-4700F Multi Beam System
    Advances in the development of new materials featuring complex nanostructures places increased demands on FIB-SEM instruments for exceptional resolution, accuracy and throughput....

  • Advances in the development of new materials featuring complex nanostructures places increased demands on FIB-SEM instruments for exceptional resolution, accuracy and throughput. In response, JEOL has developed the JIB-4700F Multi Beam System to be used in morphological observations, elemental and crystallographic analyses of a variety of specimens.

    The JIB-4700F features a hybrid conical objective lens, GENTLEBEAM™ (GB) mode and an in-lens detector system to deliver a guaranteed resolution of 1.6nm at a low accelerating voltage of 1 kV. Using an "in-lens Schottky-emission electron gun" that produces an electron beam with a maximum probe-current of 300nA, this newly-developed instrument allows for high-resolution observations and fast analyses. For the FIB column, a high-current density Ga ion beam of up to 90nA maximum probe-current is employed for fast ion milling and processing of specimens.
    Concurrent with high-speed cross-section processing by FIB, high-resolution SEM observations and fast analyses can be conducted utilizing energy dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD). Additionally, a three-dimensional analysis function that automatically captures SEM images at certain intervals in cross-section processing is provided as one of the JIB-4700F's standard features. 

    High resolution SEM observation

    Guaranteed resolution of 1.6 nm at a low accelerating voltage of 1 kV is delivered by a magnetic/electrostatic hybrid conical objective lens, GB mode and in-lens detector.

    Fast analysis

    Fast analysis is enabled because high resolution can be maintained in analyses under large probe-current by the combination with an in-lens Schottky-emission electron gun and aperture angle control lens.

    High speed processing

    High-power Ga ion beam column enables rapid processing of specimens.

    Enhanced detection system

    Simultaneous detection system involving the newly-developed in-lens detectors allows for real-time observation of images from up to 4 detectors.

    Versatility

    The JIB-4700F is compatible with a variety of optional attachments including EDS, EBSD, cryo-transfer systems, cooling stages and air-isolated transfer systems, etc.

    Three-dimensional observation/analysis

    Three-dimensional visualization of images and analysis data is possible with the combination with high-resolution SEM and appropriate optional analysis unit(s).

    Stage linkage function

    With the atmosphere pick-up system (optional) and stage linkage function, TEM (transmission electron microscope) specimens can be retracted with ease.

    Picture overlay system

    Overlaying an optical microscope image from the atmosphere pick-up system on FIB images makes it easier to identify a FIB processing point.

  • [JEOL] IB-19520CCP Cross Section Polisher
    Thermal damage can be reduced by cooling the specimen with liquid nitrogen during processing. Designed to suppress the consumption of liquid nitrogen, allowing long cooling periods....

  • Thermal damage can be reduced by cooling the specimen with liquid nitrogen during processing.
    Designed to suppress the consumption of liquid nitrogen, allowing long cooling periods.
    Rapid cooling of the specimen while immersed in liquid nitrogen. Return to room temperature. Designed to allow parts to be detached.
    Incorporates a mechanism to allow the process from polishing to observation to be performed with exposing the sample to the air.

    Specifications

    Ion accelerating voltage

    2 to 8kV

    Ion beam width

    500 μm (full width at half maximum)

    Milling speed

    500 μm/h
    (The average value over 2 hours, at accelerating voltage: 8 kV, specimen: Si, 100 μm from edge)

    Specimen holder ultimate cooling temperature

    -120℃ or less

    Specimen cooling hold time

    8 Hours or more

    Coolant tank capacity

    Approximately 1 L

    Maximum specimen size

    Dimensions: 11mm(W)×8mm(D)×3mm(H)

    Stage movement range

    X-axis;±6mm, Y-axis; ±2.5mm

    Specimen fixing method

    Clipping

    Specimen milling swing angle

    ±30°(Patent US4557130)

    Monitoring camera magnification

    Approximately ×20 to 100 (6.5-inch display)

    Air-isolation system

    Transfer vessel

    Air-isolation method

    Set the inside of the chamber to a gas environment, cover the transfer vessel with a cap, and encapsulate the specimen into the vessel.

    Operation

    Touch panel, 6.5-inch display

    Gas 

    Argon gas (flow rate controlled by mass-flow controller)

    Pressure gauge

    Penning vacuum gauge

    Main evacuation pump

    Turbo molecular pump

    Auxiliary evacuation pump

    Rotary pump

    Dimensions and Masses

    Main unit: Approx. 670mm (W) × 720mm (D) × 530mm (H) , Approx. 73㎏
    Rotary pump: Approx. 150mm(W) × 430mm(D) × 230mm(H), Approx. 16㎏

    Option

    Large Specimen Rotation Holder (IB‐11550LSRH)
    Mounting Base Specimen Holder(IB‐11560MBSH)
    Large Specimen Holder(IB-11570LSH)
    Carbon Coating Holder(IB-12510CCH)

    Installation Requirements

    Power supply

    Single phase 100 to 120V±10%, 50/60Hz, 0.6KVA

    Grounding terminal

    100Ω or less 

    Argon gas

    Pressure; 0.15±0.05MPa(1.0 to 2.0㎏f/cm2), Purity: 99.9999% or more, (Argon gas, cylinder, and the regulator must be prepared by customer) hose connector; JISB0203Rc1/4

    Room temperature

    15 to 25℃

    Humidity

    60% or less

    * Specifications subject to change without prior notice.

  • JSM-7900F Schottky Field Emission Scanning Electro
    JSM-7900F is JEOL’s new flagship FE-SEM which combines extreme high resolution imaging, enhanced stability and exceptional ease of use for any level of operator in multi-purpose environment....

  • Neo Engine(New Electron Optical Engine)

    Newly developed functionality that integrates lens control system and automatic technology, "Neo Engine" (New Electron Optical Engine) is a standard feature. Even though electron optical condition is changed, there is neglegible change in beam alignment, allowing for fast and easy image acquisition at any accelerating voltage and probe current.
    The system is the premier example of the advanced JEOL’s electron optics technology.

    ①Improvement of automation function

    Specimen: Cross section of mineral (resin-embedded) milled by CP, Acc. Vol.: 5kV, Detector: RBED, Magnification: ×100,000

    Auto function provides auto focus adjustment with in a few seconds.

    ②Improvement of Magnification accuracy

    Specimen: Specimen for metrology (MRS5), Acc. Vol.: 10kV, Magnification: ×50,000

    Magnification accuracy is highly improved and high accuracy size measurement is available.

    ③Improved usability of energy filter mode

    Specimen: Name card, Acc. Vol.: 15kV, Detector, UED, Magnification: ×3,500

    Even though energy filter range is changed, there is minimal change in field of view and focus.

    GBSH-S(GENTLEBEAM™ Super High resolution Stage bias mode)

    GBSH is a method which improves spatial resolution at any accelerating voltage.
    Maximum 5kV bias voltage to sample stage is available by newly developed GBSH-S.
    ※GENTLEBEAM™ is the function which decelerates illuminated electron beam and accelerated electron signal using biased voltage for sample.

    New Backscattered Electron Detector

    The newly developed ultra high sensitive backscattered electron detector provides us clear contrast image. Detector sensitivity is highly improved and high compositional contrast image can be observed at low accelerating voltage.


    Sample: Cu cross section, Incident electron: 3kV, Magnification: ×10,000, WD: 4.5 mm

    New Platform

    New appearance design implements compact footprint.
    This offers additional flexibility for instrument installation.

    New Sample Exchange method

    Newly designed sample exchange system (load lock type) is applied.
    Simple operation provides enhanced ease of use and improves through-put and durability of the instrument.
    High through-put and reliable sample exchange system is available for beginner users and experienced users.

    SMILENAVI

    SMILENAVI is an operation navigation system designed to assist novice users to quickly and efficiently learn the basic operation of the instrument.
    When a button shown in the SMILENAVI is clicked, the corresponding button is emphasized to clearly show the location of the button for the next operation.

    ①Highlighted buttons

    When you hover the mouse pointer over a button on SMILENAVI, a frame is displayed on the corresponding button on PC-SEM.
     

    When a button on SMILENAVI is clicked, the screen is grayed out except the corresponding button on PC-SEM.
     

    ②Showing locations

    When a button of hardware key on SMILENAVI is clicked, the picture of operation panel and the hardware key are displayed.
     

    Inherited High Performance

    In-Lens Schottky Plus Electron Gun

    In-Lens Schottky Plus Field Emission Electron Gun implements higher brightness by improving combination of electron gun and low aberration correction condenser lens.
    This allows the user tp-obtain probe current from a few pA to a few decades nA even at low accelerating voltage. The system provides users high resolution observation, high-speed element mapping and EBSD analysis.

    ACL (Aperture Angle Control Lens)

    ACL is attached above the objective lens and optimizes electron beam convergence angle in all range of probe current automatically. Hence, probe diameter is always minimized because illuminated electron beam’s convergence angle is adjusted automatically even though probe current amount is changed. It’s possible to collect both high resolution images and microanalytical data smoothly even though probe current is widely changed.

    Super Hybrid Lens

    JEOL’s developed superimposed electrostatic / magnetic field lens type objective lens, "Super Hybrid Lens" as standard, provides us ultra high spatial resolution observation and analysis for any type of samples including magnetic and non-conductive sample.

    Detector system

    Maximum 4 detectors’ simultaneous signal acquisition is available.
    A Lower Electron Detector (LED) and Upper Electron Detector (UED) are standard, in addition, a Retractable Backscattered Electron Detector (RBED) and an Upper Secondary Electron Detector (USD) are available as optional items.

    High Spatial Resolution Observation

    GBSH (GENTLEBEAM™ Super High resolution mode) provides us high spatial resolution images at ultra low accelerating voltage.
    ※GENTLEBEAM™ is the function which decelerates illuminated electron beam and accelerates discharged electron signal using biased voltage for sample.

    Low vacuum function

    Low vacuum function can provide us observation and analysis of non-conductive sample without conductive coating easily and with high spatial resolution.



BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. 

These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and Fairguide.com or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.