TESCAN SOLARIS is a turnkey FIB-SEM solution for ultra-thin TEM lamella preparation in semiconductor failure analysis labs. TESCAN SOLARIS combines the most precise Ga focused ion beam with UHR-SEM immersion optics to ensure the best possible synergy between ion beam milling and ultra-high-resolution SEM imaging.
TESCAN SOLARIS provides users with the capability to create high quality TEM lamella with minimal surface beam damage or milling artifacts, even from today`s most advanced semiconductor devices like 7nm FinFETs or 3D NANDs. Easily prepare not only standard (top-down) lamella, but also inverted, planar or double-cross lamella using our optimized in-situ lift-out geometries, workflows and specialized sample holders.
The Orage™ Ga+ FIB column was designed to meet increasingly stringent TEM lamella preparation requirements. With its ultimate FIB resolution, broad range of beam current choices and excellent performance at low beam energies, the Orage™ FIB column enables fast sputtering rates for large-volume milling tasks, superior throughput and minimum time to complete analyses.