ZEISS Xradia Versa 3D X-ray Microscopes
Non-destructive High Resolution Fault Imaging
Extend the boundaries of non-destructive physical failure analysis (PFA) and production quality control (QC) for semiconductor packages with your ZEISS X-ray microscope. Acquire high-resolution 3D images and tomography of fault locations within fully intact packages, and view virtual cross-sections in any orientation with <700 nm resolution.
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