Exis Tech Sdn Bhd

Negeri Sembilan, 
Malaysia
http://www.exis-tech.com
  • Booth: 1326


Thank you for visiting Exis Tech!

Exis Tech was established in 2002 and specializes in the design and manufacture of automated handlers for the semiconductor industry. The company also produces manufacturing automation solutions for a wide range of non-semiconductor applications.

Exis Tech’s main product offerings are:

  • Turnkey solutions for manufacturing automation
  • ODM services for machine design & manufacturing
  • Turret-based semiconductor handlers
  • Linear pick-and-place handlers
  • Wafer-level handlers

As companies seek to improve productivity and increase manufacturing yields, Exis Tech’s handlers and automation solutions will provide the necessary boost to leapfrog the competition. Its highly-modular handlers offer flexible configuration options and can be quickly retrofitted as requirements change.

For more information on Exis Tech and our products, visit our website at www.exis-tech.com.  


 Products

  • EXIS 250
    The EXIS 250 is a high-speed, high-accuracy turret handler designed specifically for use in the semiconductor industry....

  • The EXIS 250 is the workhorse for semiconductor back-end applications, supporting a wide variety of input and output mediums. The high-speed, high-accuracy turrets can be customized with a wide variety of application packages, thanks to an advanced modular design. Conversion kits are available to quickly switch between different package applications, making the EXIS 250 a highly cost-effective solution.

    • Machine Type: Test Handler with Independent Z Axis
    • Units per Hour: 50,000+ @ 38ms Test Time (Actual performance may vary with component)
    • Number of Stations: 20
    • Processes: Orientation, Flip, Test (Up to 8 Stations), Vision Inspection, Laser Marking, Repack, Retest, Reject, Sort
    • Productivity: MTBA: > 60min, Conversion Time: < 45min
    • Machine Configuration:
      • Component Size: 1x1 to 12x12 mm²
      • Package: Lead Discrete, Power Discrete, QFN, SOIC, BGA
      • Input (Standard): Bowl
      • Input (Optional): Tray, Tape, Tube
      • Test Interface (Standard): TTL
      • Test Interface (Optional): RS232, GPIB, TCPIP, SECS GEM
      • Output (Standard): Tape & Reel
      • Output (Optional): Tray, Tube, Bulk, Dual Tape
      • Test Contact (Standard): Flat Test / Clamping Test
      • Test Contact (Optional): Kelvin & non-Kelvin Solution
      • Vision (Standard): Orientation, 2D, 3D, Mark, 5S
      • Vision (Optional): In Pocket, Post Seal, OCR
      • Contacting Force (Standard): 300g (3N) to 3000g (30N)
      • Contacting Force (Optional): Up to 6000g (60N)
      • Intelligent Features:
        • Pick Up Head Auto Calibration
        • Height Auto Compensation
        • Contact Impulse Elimination
    • User Interface: PC Based - Windows 7, Dual 17”Square Touch Screen Monitor Dedicated For Machine & Vision
    • Power Specifications: 115/230Vac, 50/60Hz, Single Phase, 1.5kW
    • Compressed Air: > 5 Bar, 600 L/min
    • Dimensions: Machine: 1.1 x 0.8 x 2.0 m, Floor Space: 1.4 x 1.2 x 2.0 m , Net Weight: 1100 kg

  • EXIS 550/700
    The EXIS 550/700 is an advanced, modular rotary handler designed specifically for the semiconductor industry with 32/40 stations for added flexibility....

  • The EXIS 550/700 is an advanced, modular rotary handler designed specifically for the semiconductor industry. Its 32/40 stations provides extra flexibility for multiple input/output options, including JEDEC industry-standard trays. With up to 8 test stations, it allows for a wide variety of tests and processes. Its modular design also allows for quick conversion turnaround time of below 45 minutes (actual time may vary depending on configuration). All these features translate into higher throughput for increased yields and productivity.

    • Machine Type: Test Handler with Independent Z Axis
    • Units per Hour: Dependent on device body size and machine configuration
    • Number of Stations: 32 / 40
    • Processes: Orientation, Flip, Test, Vision Inspection, Laser Marking, Repack, Retest, Reject, Sort
    • Test Stations: 8
    • Productivity: MTBA: > 60min, Conversion Time: < 45min
    • Machine Configuration:
      • Input (Standard): Tray
      • Input (Optional): Bowl, Wafer, Tape, Tube
      • Output (Standard): Tape & Reel
      • Output (Optional): Tray, Tube, Bulk, Dual Tape
      • Component Size: 0.8 mm² to 10 mm²
      • Component Package: Lead Discrete, Power Discrete, QFN, SOIC, BGA
      • Test Interface (Standard): TTL
      • Test Interface (Optional): RS232, GPIB, TCPIP, SECS GEM
      • Test Contact (Standard): Flat Test / Clamping Test
      • Test Contact (Optional): Kelvin & non-Kelvin Solution
      • Vision (Standard): Orientation, 2D, 3D, Mark, 5S
      • Vision (Optional): In Pocket, Post Seal, OCR
      • Contacting Force (Standard): 300g (3N) to 3000g (30N)
      • Contacting Force (Optional): Up to 7000g (70N)
      • Intelligent Features:
        • Pick Up Head Auto Calibration
        • Height Auto Compensation
        • Contact Impulse Elimination
    • User Interface: PC Based - Windows 7, Dual 17”Square Touch Screen Monitor Dedicated For Machine & Vision
    • Power Specifications: 115/230Vac, 50/60Hz, Single Phase, 1.5kW
    • Compressed Air: > 5 Bar, 600 L/min
    • Dimensions: Machine: Max. Footprint: 1800mm x 1200mm x 960mm, Net Weight: 1,200 kg

 Additional Info

New Exhibitor:
No
New Products:
No
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Semiconductor