Hefei ImagEx Electronics Technology Co., Ltd.

  • Booth: C1213

Overview

Hefei Imagex Electronic Technology Co., Ltd is a corporation established in  April 2009. Imagex delivers high quality vision inspection, services and provides the best solution in semiconductor, electronics, solar energy and other fields in application, research and development.  

Imagex has the best 2D & 3D vision inspection technology and AI defect inspection technology. Our product includes:chip package surface inspection module, dimensional measurement module, shape-to-pair module, 3D measurement module and AOI surface defect inspection system.

Our main customers are semiconductor sealing plant, Fab and IC package design industry which base not only China but also South East Asia counties. Currently our IC packaging vision inspection system has become the first choice of domestic and international enterprise.

Imagex has its own intellectual property right, professional research and development team and high efficiency service support team to deliver excellent service to end user.


  Products

  • Intape 3D module
    This product apply for semiconductor packaging and process. It cooperate with domestic and international essential turret equipment and able to collect 3D lead information by inspecting product in the Carrier tape....

  • The system advantage:

    1、Compared with the conventional stereo vision computing system that uses two sets of optical equipment, this module only uses one set of optical equipment, which can also achieve the calculation effect of the conventional stereo vision system;

    2、Compact size design, suitable for all main turret installation space;

    3、Advanced efficient 3D data processing algorithm, fast operation speed, does not affect the efficiency of the machine;

    4、Carrier Intape 3D inspection, resolved and provide solution to existing 2D Carrier tape detection inaccuracy and misjudgment issue.

    Detection function:

    1、3D Lead Inspection :Used to detect whether the stance of the pin is qualified;

    2、Mark Inspection: error \ Offset \ Missing \ Broken Mark \ Extra Mark \ Illegible \ Double mark. etc;

    3、Surface Inspection: Scratch, Stain, Defect, Crack, Incompletely fill, Void, DE flash, etc;

    4、2D Lead Inspection (SOT/SOP series) : Length, Pitch, Width, Length variance, Slant, Span.

    Optical part:A single vision module realizes a stereo vision module to accurately measure 3D data.

    algorithm:Optimized and streamlined 3D matching algorithm.

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