Novatiq Scientific Sdn Bhd (Tescan)

The configuration in FIB-SEM systems is such that the electron and ion beam focal points coincide, which results in the optimisation of many applications. Such a feature enables simultaneous SEM imaging during FIB milling tasks – a significant leap in terms of performance and throughput in all those FIB operations which demand ultimate levels of precision.

TESCAN offers two different ion species as source for FIBs: Gallium ions and Xenon ion plasma. Ga ion source FIB is for all those applications that need ultimate precision in fabrication and nanopatterning. On the other hand, Xe plasma FIBs enable high ion beam currents that make it possible to remove large volumes of material in times frames that can be up to 50 × shorter compared to Ga-FIBs. In terms of precision, our high-resolution Xe plasma FIBs can achieve resolution of < 15 nm for all those delicate tasks that need power and precision combined.

Our wide range of FIB-SEM systems are aimed to satisfy from basic industrial routine applications to the most advanced and challenging technological applications that demand the highest standards in imaging and micro/nanomachining for their complex workflows.

Scanning Electron Microscopy has become an essential tool for materials science and engineering. TESCAN offers an extended portfolio of turnkey systems, tailored to help scientists and researchers in materials science make progress and achieve their goals. TESCAN’s broad range of dedicated and innovative instruments is part of our firm commitment to push materials science forward.

The scanning electron microscopes produce high magnification images with high resolution, a feature of which makes them suitable tools for a wide range of applications in numerous fields of science and industry.

TESCAN SEM: 

VEGA

• Analytical SEM for routine materials characterization, research and quality control applications at the micron scale
• Analytical platform featuring fully integrated TESCAN Essence™ EDS, which efficiently combines SEM imaging with elemental composition analysis in a single Essence™ software window.
• Optimum imaging and analytical conditions immediately available thanks to TESCAN’s unique apertureless optical design powered by In-flight Beam Tracing™.
• Effortless and precise SEM navigation on the sample at magnifications as low as 2× without the need for an additional optical navigation camera due to the unique Wide Field Optics™ design.
• SingleVac™ mode as a standard feature for observing charging and beam-sensitive samples.
• Intuitive and modular Essence™ software designed for effortless operation regardless of a user’s experience level.
• Ultimate safety of the chamber mounted detectors when the stage and sample are in motion is guaranteed with Essence™ 3D Collision model.
• Optional vacuum buffer significantly reduces vacuum rotary pump run-time to deliver both ecological and economic benefits.
• The modular analytical platform which can be optionally equipped with the widest selection of fully integrated detectors (e.g. CL, Water-cooled BSE or RAMAN spectrometer).

TESCAN FESEM:

MIRA

• High-resolution analytical SEM for routine materials characterization, research and quality control applications at the sub-micron scale
• Analytical platform featuring fully integrated TESCAN Essence™ EDS, which efficiently combines SEM imaging with elemental composition analysis in a single Essence™ software window.
• Optimum imaging and analytical conditions immediately available thanks to TESCAN’s unique apertureless optical design powered by In-flight Beam Tracing™.
• Effortless and precise SEM navigation on the sample at magnifications as low as 2× without the need for an additional optical navigation camera due to the unique Wide Field Optics™ design.
• SingleVac™ mode as a standard feature for observing charging and beam-sensitive samples.
• Intuitive and modular Essence™ software designed for effortless operation regardless of a user’s experience level.
• Ultimate safety of the chamber mounted detectors when the stage and sample are in motion is guaranteed with Essence™ 3D Collision model.
• Optional vacuum buffer significantly reduces vacuum rotary pump run-time to deliver both ecological and economic benefits.
• The modular analytical platform which can be optionally equipped with the widest selection of fully integrated detectors (e.g. CL, Water-cooled BSE or RAMAN spectrometer).

CLARA

• Field-free analytical UHR SEM for materials characterization at the nanoscale
• Uncompromised characterization of all types of materials at the nanoscale
• Ideal for characterization of materials at low beam energies for maximum surface topography
• Excellent imaging of beam-sensitive and non-conductive samples
• Fully automated setup of electron beam – optimal imaging conditions are guaranteed by the In-Flight Beam Tracing™
• Intuitive live SEM navigation on the sample at magnification as low as 2× without the need of an extra optical navigation camera thanks to the Wide Field Optics™ design
• Unique In-Beam Multidetector design allowing angle and energy selective BSE detection
• Intuitive software modular platform designed for effortless operation regardless of users’ skill level

MAGNA

• UHR SEM for nanomaterials characterization at sub-nanometer scale
• High-resolution and high-contrast imaging of nextgen materials (e.g. catalyst structures, nanotubes, nanoparticles and other nanoscale structures)
• Excellent platform suitable for SEM/STEM metrology at sub-nanometer scale
• Fast setup of the electron beam – optimal imaging conditions are guaranteed by the In-Flight Beam Tracing™
• Multi-detector system TriBE™ and TriSE™ for sample nanocharacterization
• Intuitive software modular platform designed for effortless operation regardless users’ skill level

TESCAN TENSOR is the world’s first dedicated 4D-STEM

for multimodal characterization of nanoscale morphological, chemical, and structural properties of functional materials, thin films, and synthetic particles, with stand-out 4D-STEM performance and unprecedented usability.

• Synchronization of Scanning with Diffraction Imaging, EDS Acquisition and Beam Blanking.
• Integrated, Near Real-Time 4D-STEM data Analysis and Processing
• Performance benefits from Electron Beam Precession and near-UHV
• A novel approach to STEM User Experience

Analytical 4D-STEM

The full picture of electron beam - specimen interaction

4D-STEM is the microscopy method of choice for true nanoscale, multimodal characterization of material properties such as morphology, chemistry, and structure. At each pixel in the STEM dataset, TESCAN TENSOR acquires a diffraction pattern and an EDS spectrum, fast and perfectly synchronized. Together, diffraction and spectroscopy data encapsulate the full picture of electron beam - specimen interaction, from which a wide range of material properties can be derived.

Differentiated 4D-STEM Performance

Performance of TESCAN TENSOR’s 4D-STEM capabilities is supported by ultrafast and precise synchronization of scanning with (direct electron) diffraction imaging, EDS acquisition, electron beam precession, beam blanking, and real-time analysis and processing of the acquired data. 

This has been made possible by integrating state-of-the-art components and techniques “from the ground up”: 

• Hybrid Pixel, Direct Electron Detection (DED)
• Near-Ultra High Vacuum within the sample area (near-UHV)
• Precession Electron Diffraction (PED)
• Fast, integrated Beam Blanking 
• Large solid angle, symmetrical, window-less EDS
• Real-time 4D-STEM analysis and processing (Explore)

TESCAN TENSOR: A STEM that is as easy to use as a SEM

Scientists, Engineers, Technicians and Students have long wanted a TEM solution that is readily usable without weeks, or months, of training on non-productive electron-optical adjustments and alignments. TESCAN TENSOR lets you spend your time on the microscope interacting with your sample, instead of the optics. This is achieved by the implementation of “measurements” with preset optical properties such as beam current, convergence angle, spot size and precession ON or OFF, adjusted and aligned automatically. 

The result: an analytical 4D-STEM that is as easy to use as TESCAN SEMs, with all the efficiency and economic benefits of a results driven Electron Microscope.

This approach potentially also yields economic benefits, such as better accessibility by novice users, leading to higher tool utilization supporting the return on investment

SPEED UP. MAXIMIZED SYSTEM UTILIZATION AND THROUGHPUT.

Maximizing throughput and reducing the cost per sample. Utilizing fast frame rate detectors and high flux x-ray sources, all TESCAN micro-CT systems provide high temporal resolution.

Acquisition times on a TESCAN micro-CT are often just seconds or minutes – not hours or days – allowing rapid screening of a large number of samples, making sure only the right samples are sent through for further investigation.

CHARACTERIZE YOUR MATERIALS. NONDESTRUCTIVE. WITH SUPERIOR IMAGE QUALITY.

TESCAN micro-CT offers superior image quality in the shortest scan times. High contrast and excellent signal-to-noise ratio combined with high resolution solve all your micro-CT needs.

TESCAN UniTOM XL enables high-throughput non-destructive 3D imaging for materials research, failure analysis and quality assurance, including:

• Energy Conversion and Storage
• Consumer Products and Packaging
• Aerospace
• Automotive
• Medical Devices
• Pharmaceutical
• Building Materials
• Food Science
• Advanced Packaging in Electronics
• Metals