QDOS Technology Sdn Bhd

BAYAN LEPAS,  PENANG 
Malaysia
http://www.qdos.com.my/
  • Booth: C601

COME VISIT QDOS AT #BOOTHC601

Overview

QDOS is a pioneer manufacturer of Flexible Printed Circuits (FPC) and Integrated Circuit Substrate (ICS) in Malaysia. Equipped with highly automated state-of-the-art facilities in three manufacturing plants, QDOS provides comprehensive FPC & ICS solutions, covering circuit design, prototype fabrication, mass production, and assembly.

Since QDOS establishment in Oct 1993, our Quality, Delivery and Outstanding Service are the pillars that have formed the foundation of QDOS today. The commitment towards excellence in FPC and ICS engineering has earned Qdos a reputable track record and long-term partnership with numerous blue-chip multi-national OEMs in telecommunications, automotive, medical, semiconductor, military and aerospace segments across 20 countries including the United States, Germany and Japan.


  Products

  • FPC, MIS, ABF BU
    1) Flexible Printed Circuits (FPC)
    2) Molded Interconnect Substrate (MIS)
    3) FCBGA Substrate (ABF BU)...

  • Flexible Printed Circuit (FPC) SS, DS, ML Flexible PCB with multiple material & finishing options. Customized assembly and delivery format available. Fine lines by mSAP process, standard 1oz with subtractive circuit formation. Molded Interconnect Substrate (MIS), Coreless ABF thin substrates by SAP circuit formation, any layer count (3+), having embedded traces, excellent thermal conductivity, high reliability and delivered in Lead Frame strip format. Product Name: FCBGA Substrate (ABF BU) a. High IO count with SOP & Coining on ENEPIG finish, each BU layer 35um with ABF, delivered in JEDEC trays.
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