QES (Asia-Pacific) Sdn Bhd

The system comes from the area, scanning camera that capable to capture defects by using the 2D vision system. Integrated with a programmable dual XY stage and on-the-fly scanning method, the system can accommodate multiple magazines at one-time operation and eliminate the waiting time.

Key Features: 

• Auto 2D Vision Inspection Tool for 3rd Optical Application

• Multiple Magazine Loader & Dual Scanning Track Mechanism

• Capable of Store Maximum up to 5 Magazines (90mm Width Each)

• Capable to Handle the Maximum Dimension of Sample up to 100mm (Width) x 300mm (Length)

• High Resolution of Camera Up to 8.9MP

• Defect Classification based on 4 Vision Tools

• Lighting Type by using Dome Light Ultra Bright for Stroboscope

• On-the-Fly Vision Scanning with Stroboscopic Control

• Programmable Recipe Control and Strip Mapping Capability

The PPI3300 is an ideal solution for detecting defects on 8-inch and 12-inch patterned wafer surfaces such as scratches, ink dot smears, probe marks, watermarks, and die edge cracks. High-Speed CMOS camera with a resolution of 26.1MP and a CoaXPress interface is used in the system. The combination of 5120 x 5120 high resolution, high speed at 90 FPS and global shutter create a new standard for the inspection application. The CF objective was used to extend the working distance while maintaining a high NA, resulting in images that are crisp and clear, with high contrast and resolution. The micro wafer station has been integrated with a rotary table and an anti-vibration platform to provide accurate and high throughput inspection. Auto loading, wafer ID reader for OCR and 2D matrix code reading, and auto defect inspection are all part of the standard system configuration

Key Features :

• 26.1MP Area-Scan Color Camera

• Bright-field Inspection

• Laser Auto focus System

• Nikon High Power Metallurgical Microscope

• Rotary Table with Vacuum Chuck

• Anti-Vibration Platform

• 1x Hirata FOUP Port

• Hirata ATM Robot with End E_ector

• Hirata Wafer Alignment Module

• IOSS WID120 OCR Reader

• HEPA/ULPA FFU (Optional)

Key Features :

• Comes with 2x FOUP/FOSB for Open Cassette for 8" Wafer with integrated Wafer Protrusion Detection Sensor and Thru Beam Wafer Mapping 

• 2x Universal Shipping Carrier Station for Various Types of Canister and Wafer Jar with Auto-Detection for 8" & 12" Wafer Size 

• 1x Interleaf Paper Port (Auto-Conversion between 8" & 12" Paper) 

• Hirata 4-Axis ATM Robot with Flip Axis (Radius-Theta-Height-Flip Axes) 

• Built-in Vision System for Wafer, Interleaf Paper or Spacer Detection and Built-in Height Sensor for Robotic Handling Accuracy 

Integrated with the motorized nosepiece Sensofar Non-Contact 3D Surface Metrology System. Confocal, interferometry, and AI focus variation are the three measuring features included in S Neox. These capabilities, together with the system's strong analysis options, each increase the system's adaptability and reduce unfavorable trade-offs in the data-collecting process. 

WSM1200 is designed with a single cassette load port to accommodate 6-inch and 8-inch SEMI Standard Open Cassette. Hirata ATM robots provide higher performance and effective wafer handling. Integrated with Sensofar Non-Contact 3D Surface Metrology System with motorized nose-piece. The three measurement features found in S Neox - Confocal, Interferometry, and Ai Focus Variation - along with excellent analysis options, each contribute to the versatility of the system and help to minimize undesirable compromises in data acquisition. The system is also integrated with the Sensofar Anti-Vibration Platform to deliver accurate and fast measurements. WSM1200 is the ideal system to measure the surface height of smooth to very rough surfaces.

Key Features :

• Designed for 150mm and 200mm Wafer

• One Load Port for SEMI-Std. Open Cassette

• Hirata 3-Axis Single Arm ATM Robot

• Hirata Wafer Pre-aligner for Wafer Orientation Check and Wafer Alignment

• IOSS WID120 OCR Reader

• Sensofar S-Neox Non-Contact Type 3D Optical Profilometer

• Objective Lenses at 10x and 20x

• Vibration Isolation Platform • TCP/IP Networking For Interface With Host Map Server, and Storage Of Map Data Over The Network

• SECS/GEM Communication Tools (Optional)

A Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measure several parameters in a single system. ( wafer & tape thicknss, roughness, TTV, bump height, bow and warp measurements ).

Key Features: 

• Thickness resolution (0.1μm) providing uniform TTV for production control of wafers 

• Measurements after back grind or dicing provides flexibilty for thickness uniformity control 

• Small focused laser spot ( 1μm ) provides the resolution required for measuring bumped wafers and via features