Overview
Regional Business Network Pte Ltd. Product & Services We serve the semiconductor wafer fab & advanced wafer level packaging (WLP, WLCSP, eWLB, Flip Chip Bumping & TSV) industry specialize in the following area:
1) Wafer Metrology & Inspection Equipment – Si/Glass thickness, Thick Film/PR layer thickness, CD, Roughness, 2D/3D Profiler, XRF, TXRF, Resistivity 4 Point Probe System.
2)Dry/Wet Etch, Thin Film Deposition process Equipment – Single wafer, batch process clean, PR-strip/Metal etch, CVD/PVD/PECVD/Plasma-RIE
3)Wafer Handling Equipment – Fully Automated Taping, Detaping(UV), Mounting/De-Mounting, Bonding, OCR/Barcode reading/printing & ultra-thin wafer transfer sorter
4)Specialty Materials & Chemicals (metal etch and photoresist strip)