SEIWA OPTICAL CO,.LTD.

Specification:
・Compatible with FOUP/FOSB/OC of various manufacturers
   In addition to the standard size of φ300mm, color cassettes can also be inspected.
・The 25-megapixel camera and dedicated optical engine enable high-definition external dimensions!
・Ultra-wide-field high-speed processing achieves the fastest throughput in the industry

https://bit.ly/4482XE2

[Use]
Defect management in semiconductor device / CMOS device manufacturing process

[Specification]
Applicable work size: 12 inch / 8 inch
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Work state: Wafer dicing
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Stage positioning accuracy: ± 1um
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Review accuracy: 3σ ≤ ± 20um
* Positioning accuracy for defect information coordinates
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Throughput: Approximately 2000 seconds (10-sheet processing)
* Number of defects: 100 / piece
* Reference imaging mode
* Depends on defect location
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Review (moving to AF to imaging) time: fastest 0.5 seconds
* Depends on defect location
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The System takes defect images and the datum are upladed to the upstream system.
The defect infomation is provided by Wafer Review System and Wafer Inspection System; AVI.
The System also analyzes the defect information from AVI.
Seiwa SAWR Series inspect your application at high speed with high precision.
We can also manufacture AVI.

https://bit.ly/4482XE2

[Overview]
is adopted an original UV optical system optimized for high-definition exposure and a mechanism
that allows the photo-mask and wafer to be paralleled with high precision.

This Fully Automatic Exposure System support 3 kinds of Gap control such as "Vacuum contact", "Soft Contact", and "Proximity Gap".

[Use]
Power device, Back side of C-MOS, MEMS, LED, Ceramics etc.

[Specification]
Available Wafer size : 12 inch, 6-8 inch, 4-6 inch, 2-4 inch or Square shape etc.
Loading method : Cassette to Cassette, Foup Load
Alignment direction : Top side, Back side (Option)
Alignment Accuracy : Top side ±0.8μm or less / Back side ±1μm or less

https://bit.ly/40KcBtx

[Use]
For Micro LED or LED

[Specification]
Tact Capacity :1st 150pcs or more/ 1hour
　　　　　　　:2nd 130pcs or more/1hour
Alignment Accuracy：0.5μm or less

https://bit.ly/40KcBtx

Overview

Equipped with 355nm UV laser
Laser oscillator, optical system, control integrated type
Air-cooled specifications that do not require cooling water
Laser maximum output 3W and also compatible with processing machines
Built-in CCD camera that can be observed coaxially with the laser
Can be equipped with a telecentric lens for processing machine applications

https://bit.ly/41ey4Ll

Overview

High speed tracking contributes to reduce the takt time
Perfect surface inspection of high reflection rate target such as wafer or glass
Selectable camera interface
Optical system can be customized according to your purpose

Specification

LAF5S-C 670mm 45 degree diagonal

Laser type : Semiconductor laser

Safety standard class : 3R

Positioning time : External trigger 0.2 sec

                          Tracking 0 sec