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Suzhou Sail Science & Technology Co., Ltd.

Suzhou,  Jiangsu 
China
http://www.sailabrasives.com
  • Booth: A502

A very warm welcome from the whole team here at Suzhou Sail

Overview

Suzhou Sail Science & Technology Co., Ltd.

Located in Suzhou industrial park, Suzhou Sail Science & Technology Co., Ltd. is a high-tech corporation specialized in research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
The company's products have fully covered touch screen glass processing, semiconductor wafer cutting, thinning and CMP and other precision processing fields, formed a complete industry chain of grinding, cutting and polishing tools required by semiconductor industry. Most of the products are advanced in domestic, and some products are in the international leading level.

  Products

  • Nickel Diamond Hub Blades
    Product Features:
    - Achieve stable processing of wafer with narrow saw street.
    - Electroformed hub type cutting blade with high cutting quality wafer cutting.
    - Blade selection based on cutting quality and blade life.
    ...

    • Application: 

    PCB, BGA, Ceramic substrate and Silicon wafer.

  • Electroformed Hubless Diamond Blade
    Product Features:
    - Suitable for various cutting process from brittle and hard materials.
    - Using high strength binder, high quality electroforming to form the blade.
    - Materialize high cutting quality for those difficult to processed materials such as SiC.
    ...

    • Application:

    PCB, BGA, Ceramic substrate and Silicon wafer.

  • M1A Series Metal Bond Dicing Blade
    Product Features:
    - Excellent wear resistance and rigidity for high precision cutting and difficult to cut materials.
    - Variety of binding material can be applied on various cutting materials
    ...

    • Application:

    Electronic components, Optical glass, Quarts, BGA and CSP packaging products.

  • B1A Series Resin Bond Dicing Blade
    Product Features:
    - New binders can be developed according to the characteristics of materials.
    - Customize the blade with different specification & performance required.
    - Self-develop raw material new mixing & hot pressing technology to ensure the quality.
    ...

    • Application:

    QFN, Optical glass, Ceramic, BGA.

Categories

300 Materials, Assembly
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
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