ZMC Technologies (Singapore) Pte Ltd

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

In close cooperation with research institutes and industry partners SUSS MicroTec contributes to key processes for Advanced Packaging and MEMS manufacturing as well as to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com

The privately held htt group was founded in 1988 in Munich. Under the mission statement "Reliability and a unique value for customers and Suppliers", the focus of htt group is to be a major supplier to the Semiconductor Industry by representing well-known leading manufacturers of systems and consumables, tools for Wafer Fab, Wafer Sort, Wafer Probe, Wafer Test, Final Test, Assembly and Backend.

With our innovative 2D/3D vision inspection technology, we were able to enter the market as a gamechanger for the semiconductor inspection industry. Our mission is to be an exceptional service supplier to our customers. As a company, we are always evolving alongside changing market conditions, and our strong emphasis on innovation and R&D are the reasons for our worldwide success. The technical strengths of our semiconductor package inspection equipment are six-sided inspection technology that directly inspects all sides of semiconductors, large form factor inspection technology that handles large-sized chips stably, and deep learning technology based on AI. Based on this technology advantage, we continue to expand our market share by conducting demos with Major customers.

•2D/3D Vision Inspection for Package Vision Inspection: Semiconductor, CIS, Memory Module, SSD, Substrate

Turbodynamics, Germany is a respected global provider of dockings/interfaces.

The company’s core technology rests in its unique and patented docking module. Its benchmark-winning docking sets are famous for their absolute precision and reliability.  This technology is also key to its best-selling Direct Dock systems.

Over the past years Turbodynamics expanded its product portfolio to include universal and mobile test head manipulators/trolleys. All products are designed and manufactured in Germany.

An innovative test floor automated Probe Card storage system is Turbodynamics’ latest product, which was successfully released in cooperation with leading IDMs.

In 2021, Turbodynamics celebrated its 15—year anniversary and was recognized and awarded as a Best Supplier by a leading IDM.

https://turbodynamics.com/en/

The company has a Shenzhen headquarters, a subsidiary in Malaysia, a production base in Huizhou, and multiple sales centers and channels in East China, South China, Southwest China, Taiwan, and other regions. The research and sales center of the Shenzhen headquarters covers an area of 2000 square meters, mainly used for the research, testing, and verification of semiconductor equipment. The Huizhou production base covers an area of 6000 square meters and can assemble and debug 300 devices at the same time. The company's research and development personnel account for 70%, and each major region has a sales manager.

The semiconductor sorting, testing, and packaging equipment developed and produced by the company is deeply rooted in advanced packaging such as wafer-level chip-scale packaging (WLCSP), system-in-package (SIP), 2.5/3.0D integrated packaging, panel-level packaging (Panel Level Package), MEMS and sensor packaging, WBBGA/WBLGA, FCBGA/FCLGA/FCCSP, Fan-out/Fan-in, third-generation compound semiconductors, and can provide one-stop high-end packaging solutions.

The core team members of our company are dedicated to the high-end equipment manufacturing field of the semiconductor industry. At the beginning of the company's establishment, we paid full attention to and realized the necessity and trend of the country's investment and the conquering of related supporting technologies in the high-end manufacturing field. Combining the experience of the founding team, we chose the direction of semiconductor advanced packaging chip sorting, testing, and packaging equipment. With the rapid development of market demand and the positive promotion of industry capital, Shenzhen Huaxin Intelligent Equipment Co., Ltd. will usher in rapid growth and development.

Our company is a provider of sorting, testing, and packaging solutions for advanced semiconductor packaging, relying on the company's strong visual system processing capabilities and operation and control system capabilities to comprehensively and deeply solve the equipment needs of current domestic and foreign customers in sorting, testing, and packaging processes to achieve cost reduction and efficiency improvement. Meanwhile, we control the research and development, procurement, production and other links to ensure equipment quality and cost control, helping the semiconductor industry upgrade and develop, realizing the independent domestic production of core equipment for China's independent chip industry, and truly helping the development and revitalization of China's semiconductor industry. Shenzhen Huaxin Intelligent Equipment Co., Ltd. closely follows the development trend of the semiconductor era, comprehensively empowering the "core" idea, and lays out the future of the "core" in advance!