CXsemi Company Limited

Features
Auto overlay & CD analysis
Wide range for film thickness
Adapt to Si, GaAs, SiC, glass wafer
Merge 3D function for step height analysis
Specifications

Robot handler, Pre-aligner, OCR, Secs/Gem
Film range: upper than 30um, option
Image Resolution/FOV: 0.11 μm/ 0.22 mm x 0.12 mm @50X
Repeatability: better than 0.020um (include TIS error)
Pattern: Box In Box, Bar to Bar, customized
Data output: X/Y- shift, X/Y-Mag, X/Y- Rot, Shot Mag/Rot
Applications

5G, RF, Fingerprint Recognition, Power device
Follow up Stepper or Aligner

1. Helps you to find the wafer warpage and stress for high reflective sample.
2. Optical and non-contact measuring, does not damage your device.
3. One shot image for the whole area, easy analysis.

• Substrate : Silicon, GaAs, Sapphire,
• Repeatability : <2um @3 sigma
• Measured speed : <5 sec/pc for 6” full field (> 0.19M data)
• Sample size : 12inch maximum
• Keyword : Wafer Warpage, Stress, Protrusion defect

1. Helps you to find the Film thickness, wafer thickness
2. Optical and non-contact measuring, does not damage your device.
3. We concentrate on the measurement of Photo Resistance thickness, that provides a flexible and customized UI design.

• Substrate : Silicon, GaAs, Sapphire, Glass, SiC
• Film material : Oxide, Nitride, PR, ITO…dielectric film
• Film thickness : Range 20nm-80 um, Repeatability<1 nm @ 500 nm Oxide on Si substrate
• Wafer thickness : Range 20 um ~ 775 um, Repeatability 0.1 um for 100 um Si wafer
• Via / Trench depth : AR>30 for CD 5 um Trench, Repeatability 0.2 um for 175um depth
• Wafer size : 12inch maximum
• Database : Built-in Template (n, k) &  Multi-layer Model Setup
• Spot size : Φ 50 μm (option to 80 μm, 120 μm, 250 μm , 1.2 mm)
• Keyword : Via / Trench, Wafer thickness, Film thickness

Throughput: 20 min/25 pcs(5 point/pcs)
Macro view, front /backside
2 inch~200/300 min wafer

1. Transfer wafer to the stage of microscope automatically and then instead of manual operator.
2. Front/back side macro inspection. Auto or Manual stage could be option. 2/4, 4/6, 6/8 inch & SiC, GaN…etc.
3. Combine with famous brand microscope and also can install CCD for marco inspection.

1. Most customers cannot assess the operating quality of robot arms because the devices do not provide clear statistics regarding the quality of vibration or displacement deviation during arm movement.
2. We provide a smart vision identification system to monitor product process or do the AI machine vision.
3. Our vision software is easier to learn and operate than other suppliers.