DR Laser Singapore Pte Ltd

TGV technology is a new vertical interconnection technology applied to the field of wafer level vacuum packaging; Owing to its excellent electrical properties, mechanical properties, airtightness and reliability, TGV technology is widely used in advanced 3D system packaging, high Q microwave/THz devices, optical/RF MEMS, microfluidic chips, new Micro LED substrates and other fields.

Hardware Parameters 

   Positioning accuracy: ≤±3μm

   Repetition accuracy: ≤±1μm

   Production capacity: 5000 point/s

Good compatibility, supporting the modification of different glass materials, including quartz, borosilicate, high aluminum, sodium calcium, etc.

Multiple forms and patterns, like round hole, square hole, buried hole, through-hole and micro-groove feasible on the substrate according to requirements.

Excellent deep hole characteristic, with depth-to-width ratio up to 50:1 and minimum pitch between holes ≤ 20μm.

Good hole quality and smooth side walls without cracks, chips, and stress.

Customized and self-developed external optical path; Customized and self-developed XY platform of high precision and straightness;

Automatic focusing function to adapt to wafer surface and height changes during moving, ensuring the processing effect of the product's modified layer;

Seamless loading and unloading, ensuring efficient and stable transfer of wafers;

Visual positioning + contour detection of complete and incomplete pieces at high accuracy and high resolution, and efficient positioning algorithms to confirm the accuracy of cutting path.

Supporting both the GEN4.5 and the latest GEN6 wires

Good compatibility, allowing repair of all film layer materials

Flexible configuration

High repair success rate ≥99.9%

Precise optical path control system

Connection with CIM system for intelligent/closed-loop feedback

With single/double pulse control, the equipment conducts rapid laser annealing on the backside of the silicon-based IGBT wafer after ion implantation, to achieve an activation depth and effectively repair lattice structures damaged by ion implantation.

10μm activation depth

WPH>25 @8"

Excellent sheet resistance uniformity and better surface color

Complete whole process monitoring and feedback capability

Supporting annealing of ultra-thin wafer, TAIKO wafer and warp wafer Laser-assisted heating system

This equipment utilises camera vision system in tandem with laser technology to automatically remove and replace defective pixels, leading to a significant increase in terms of product yield.

Boasting high degree of intelligence, and integrating visual defective pixels identification, removal and repair as well as re-inspection

Allowing automatic compensation of soldering parameters according to the conditions (category of chip/solder paste).

Substrate compatible with PCB, FPC and glass ranging from 8 to 30 inches, and defective size ranging 3x5mil~60x60mil

High mounting accuracy and low offset angle

Success rate of repair >95%, and high repair reliability promotion ≥400g

It features compact space, small footprint, simple structure, convenient commissioning, standardized module design, and high compatibility and interchangeability.

With this equipment, multiple production modes, including two-laser beam, three-laser beam and four-laser beam, are possible to realize full coverage from low to high production capacity.

Composed of a host and a connection station, the equipment supports manual loading/unloading and AGV loading/unloading, satisfying customers’ varying loading requirements.

It can be directly connected to the commercially available printer of any brand due to its high compatibility and flexibility.

  Designed with customized laser and special optical path, to incorporate intelligent manufacturing technologies

  Flexible graphic control modes, supporting multiple types of graphics including points, lines, dotted and solid lines

  Realizing 15-50μm ultra-fine line width, non-destructive ablation, automatic microscale positioning and global correction