E & R Engineering Corporation

Kaohsiung City,  Taiwan
http://www.enr.com.tw
  • Booth: C1109

Categories

200 Equipment, Assembly
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Hot Embossing System
  • Lead Finishing; Straightening Equipment
  • Lead frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Package Simulation; Characterization Equipment
  • Plating;Electro Chemical Plating for Device assembly
  • Printing Equipment; Screen-printing; Alignment; Film Printing
  • PROM; Memory Programmer Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Base Loader Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
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