INSPECTION
Inspection Capabilities - Detecting wafer cosmetic defect, measurement, ink dot for wafer, probe mark & etc
Recipe / Setup (On and O_-Line) - Automatic “golden die” image generation from production wafer. Interactive graphical tools for various zone definition. User-defined detection parameters per defects and zones.
Resolution - Changeable with multiple lens, up to 0.35μm per pixel
Accuracy - up to 0.7μm | Represents deviation between average of the distribution of results of repeated measurements of golden target and it certified value.
Repeatability - up to 0.7μm at 3 sigma | Represents 3 sigma deviation value of the distribution of results of repeated measurements of the same real component.
Minimum Defect Detection - up to 1μm
SYSTEM CONFIGURATION
Factory Automation - Secs/Gem
Cleanliness - Class 100/1000
Particles removal system - Hepa System
WAFER HANDLING
Wafer ID - Reading capability: SEMI M12, M13, M1.15, T1.95 | OCR | ECC200, T7 DtaMatrix, QR-Code | BC412, IBM412
Wafer Type - Wafer & Film Frame Wafer
Supported Wafer Size - 6", 8" & 12"
Wafer Cassettes - Standard Cassettes: Entegris, Empak or Fluoroware (FOUP Optional)
Wafer Handling - Twin Arms Wafer Robot with Slot Sensor (Mapping)
OUTPUT
Output Data - Wafer Map, SPC Analysis Report, KLARF
MACHINE LAYOUT
Dimension - L1620 x W2235 x H1950mm