Welcome to the "Thin Film Powerhouse".
Overview
Evatec delivers complete thin film production solutions for Advanced Packaging, Semiconductor, Optoelectronics and Photonics. We offer a range of batch, cluster and inline platform architectures for deposition of metals, TCOs, and dielectrics according to your production throughput and fab integration needs. Evatec Advanced Process Control (APC) technologies maximise throughput and process yield.
From the sputter deposition of next generation AlScN piezoelectric materials enabling 5G on CLUSTERLINE® to new clustered high throughput metallization solutions on 6 and 8 inch in our Multi BAK ( BAK 941) Evaporators, visit our booth to find out how our production tools can help you solve your production challenges in MEMS, Power Devices and Wireless Communication.
Visit the booth to learn about our new generation HEXAGON tool, designed for Wafer Level Packaging applications to give the lowest Rc values and the best cost of ownesrhip in the industry. Within Optoelectronics drive down your costs for deposition of ITO, mirrors and contacts in production of LED, VCSEL and Micro Display using the latest developments on our CLUSTERLINE® 200 BPM that enhance uniformity, drive down particles and enhance throughput.
The Evatec team look forward to welcoming you to booth C910.