Flexible Printed Circuit (FPC) SS, DS, ML Flexible PCB with multiple material & finishing options. Customized assembly and delivery format available. Fine lines by mSAP process, standard 1oz with subtractive circuit formation. Molded Interconnect Substrate (MIS), Coreless ABF thin substrates by SAP circuit formation, any layer count (3+), having embedded traces, excellent thermal conductivity, high reliability and delivered in Lead Frame strip format. Product Name: FCBGA Substrate (ABF BU) a. High IO count with SOP & Coining on ENEPIG finish, each BU layer 35um with ABF, delivered in JEDEC trays.