Incorporate in year 2014
Zi Lian Malaysia Sdn. Bhd. is a forward-looking company focusing on Technology Transfer and
Resource Integration in collaboration with worldwide associate partners.
We represent world class equipment and tools, provide engineering and project management services.
Wafer Size (晶圓尺寸) : 4”6”8”
Thin wafer transfer :
Thin Wafer (薄化晶圓厚度) : 200~1000um
Visual Inspection : Macro Inspection
Wafer Tope : X,Y
Rotation : 360°
Wafer Back : Back center / Edge