SCROLL
ABOUT US ·
API is a global manufacturer of high-technology equipment, specializing in precision pick & place and advanced packaging solutions for semiconductor back-end and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, offering comprehensive technical support and considerate services worldwide.
Dies We Bonded
Machines Running Production in Field
Equipment Stabilisation Time for Mass Production
TECHNOLOGY ·
PRODUCTS ·
Advanced Bonder for Multi Chip/Module Attach
Ultra-Thin-Die Stacking Bonder
Semiconductor Packaging Intelligent Inline Solution
NEWS·
Visit our Booth: Hall 2-1524
Advanced Packaging Solutions:
. Ultra-Thin-Die Stacking Bonder
. Semiconductor Packaging Intelligence Inline Solution
. Advanced Bonder for Multi Chip/Module Attach
